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XC7A200T-2FFG1156I
Part Number	XC7A200T-2FFG1156I
Manufacturer	Xilinx
Description	IC FPGA ARTIX7 500 I/O 1156FCBGA
Quantity Available	1004 pcs new original in stock. Request Stock & Quotation
ECAD Model
Datasheets	1.XC7A200T-2FFG1156I.pdf 2.XC7A200T-2FFG1156I.pdf
Download	XC7A200T-2FFG1156I Details PDF
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Technical Information of XC7A200T-2FFG1156I
Manufacturer Part Number	XC7A200T-2FFG1156I	Category	Integrated Circuits (ICs)
Manufacturer	Xilinx	Description	IC FPGA ARTIX7 500 I/O 1156FCBGA
Package / Case	BGA1156	Quantity Available	1004 pcs
Voltage - Supply	0.95 V ~ 1.05 V	Total RAM Bits	13455360
Supplier Device Package	1156-FCBGA (35x35)	Series	Artix-7
Package / Case	1156-BBGA, FCBGA	Other Names	122-1964 XC7A200T-2FFG1156I-ND
Operating Temperature	-40°C ~ 100°C (TJ)	Number of Logic Elements/Cells	215360
Number of LABs/CLBs	16825	Number of I/O	500
Mounting Type	Surface Mount	Moisture Sensitivity Level (MSL)	4 (72 Hours)
Manufacturer Standard Lead Time	15 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Base Part Number	XC7A200T
Download	XC7A200T-2FFG1156I PDF - DE.pdf

Product Model

XC7A200T-2FFG1156I

Introduction

High capacity FPGA for embedded applications

Brand and Manufacturer

Xilinx

Features

Large number of logic cells

Abundant programmable logic blocks

High volume of total RAM bits

Generous number of I/O ports

Low voltage supply range

Supports surface mount technology

Wide operating temperature range

Product Performance

Efficient logic utilization

Robust memory capacity

Optimized I/O resources for flexible design

Stable performance under varying temperature conditions

Technical Specifications

1156-BBGA, FCBGA package

16825 LABs/CLBs

215360 Logic Elements/Cells

13455360 Total RAM Bits

Dimensions, Shape, and Packaging

1156-FCBGA (35x35 mm package size)

Packaged in trays

Rectangular shape, surface mount

Quality and Reliability

Highly reliable in stringent temperature conditions

Designed for long-term performance

Product Advantages

Enhanced logic density for complex designs

Integrated memory for comprehensive data management

Robust thermal management for increased reliability

Product Competitiveness

Competitive in performance and flexibility among FPGAs

Highly sought after for sophisticated embedded designs

Compatibility

Compatible with numerous design tools and software

Flexible I/O interface supports various peripheral devices

Standard Certification and Compliance

Compliant with industry standard regulations and protocols

Certified for operation in critical applications

Lifespan and Sustainability

Durable design ensures prolonged operational lifespan

Sustainable product with potential for recycling and reuse

Actual Application Fields

Widely used in telecommunications

Suitable for automotive industry applications

Applicable in consumer electronics

Favored for aerospace and defense projects

Integral in industrial automation systems

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