XC6SLX75T-2FGG676I
Part Number XC6SLX75T-2FGG676I
Manufacturer Xilinx
Description IC FPGA 348 I/O 676FBGA
Quantity Available 700 pcs new original in stock.
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ECAD Model
Datasheets XC6SLX75T-2FGG676I.pdf
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Technical Information of XC6SLX75T-2FGG676I
Manufacturer Part Number XC6SLX75T-2FGG676I Category Integrated Circuits (ICs)
Manufacturer Xilinx Description IC FPGA 348 I/O 676FBGA
Package / Case 676FBGA Quantity Available 700 pcs
Voltage - Supply 1.14 V ~ 1.26 V Total RAM Bits 3170304
Supplier Device Package 676-FBGA (27x27) Series Spartan®-6 LXT
Package / Case 676-BGA Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 74637 Number of LABs/CLBs 5831
Number of I/O 348 Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours) Manufacturer Standard Lead Time 10 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant Base Part Number XC6SLX75
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Product Model


XC6SLX75T-2FGG676I

Introduction


High-performance FPGA for embedded systems

Brand and Manufacturer


Xilinx

Features


High integration

Versatile I/O options

Energy efficient

Product Performance


Optimized for logic-intensive applications

Supports complex digital computations

Technical Specifications


676-FBGA package

1.14 V ~ 1.26 V supply voltage

5831 LABs/CLBs

348 I/O pins

3170304 total RAM bits

74637 logic elements/cells

Dimensions, Shape, and Packaging


676-BGA, 27x27 mm, FBGA packaging

Quality and Reliability


Lead free, RoHS compliant

MSL 3 certified

Product Advantages


Flexible programming

Scalable architecture

Product Competitiveness


Leading-edge integration and performance in its category

Compatibility


Wide range of voltage and interfacing options

Standard Certification and Compliance


Lead free, RoHS

Lifespan and Sustainability


Durable design, suited for long-term applications

Actual Application Fields


Advanced embedded systems

Digital signal processing

Industrial control systems

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