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XC3S100E-4CPG132I
Part Number	XC3S100E-4CPG132I
Manufacturer	Xilinx
Description	IC FPGA 83 I/O 132CSBGA
Quantity Available	2050 pcs new original in stock. Request Stock & Quotation
ECAD Model
Datasheets	XC3S100E-4CPG132I.pdf
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Technical Information of XC3S100E-4CPG132I
Manufacturer Part Number	XC3S100E-4CPG132I	Category	Integrated Circuits (ICs)
Manufacturer	Xilinx	Description	IC FPGA 83 I/O 132CSBGA
Package / Case	BGA	Quantity Available	2050 pcs
Voltage - Supply	1.14 V ~ 1.26 V	Total RAM Bits	73728
Supplier Device Package	132-CSPBGA (8x8)	Series	Spartan®-3E
Package / Case	132-TFBGA, CSPBGA	Operating Temperature	-40°C ~ 100°C (TJ)
Number of Logic Elements/Cells	2160	Number of LABs/CLBs	240
Number of I/O	83	Number of Gates	100000
Mounting Type	Surface Mount	Moisture Sensitivity Level (MSL)	3 (168 Hours)
Manufacturer Standard Lead Time	10 Weeks	Lead Free Status / RoHS Status	Lead free / RoHS Compliant
Base Part Number	XC3S100E
Download	XC3S100E-4CPG132I PDF - DE.pdf XC3S100E-4CPG132I PDF - FR.pdf XC3S100E-4CPG132I PDF - ES.pdf XC3S100E-4CPG132I PDF - IT.pdf XC3S100E-4CPG132I PDF - KR.pdf

Product Model

XC3S100E-4CPG132I

Introduction

Embedded FPGA for high-performance digital processing

Brand and Manufacturer

Xilinx

Features

240 LABs/CLBs

2160 Logic Elements/Cells

73728 Total RAM Bits

83 I/O Pins

Product Performance

100000 Gates

Operates over a voltage supply of 1.14V to 1.26V

Technical Specifications

Embedded FPGA category

Surface mount technology

132-TFBGA, CSPBGA packaging

Dimensions, Shape, and Packaging

Packaged in a 132-CSPBGA (8x8) format

Tray packaging

Quality and Reliability

Designed for extended operation from -40°C to 100°C

Product Advantages

High gate count for complex digital circuits

Compact and robust design suitable for dense board layouts

Product Competitiveness

Positioned for applications requiring high integration and low power consumption

Compatibility

Compatible with standard FPGA design tools

Standard Certification and Compliance

Complies with industry standard specifications for embedded FPGAs

Lifespan and Sustainability

Last Time Buy status indicates approaching end of production lifecycle

Actual Application Fields

Suitable for telecommunications, automotive electronics, and consumer electronic applications

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