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XC2VP2-6FGG256C
Part Number	XC2VP2-6FGG256C
Manufacturer	Xilinx
Description	IC FPGA 140 I/O 256FGBGA
Quantity Available	2899 pcs new original in stock. Request Stock & Quotation
ECAD Model
Datasheets	XC2VP2-6FGG256C.pdf
Download	XC2VP2-6FGG256C Details PDF
XC2VP2-6FGG256C Price	Request Price & Lead Time Online or Email us: Info@ariat-tech.com

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Technical Information of XC2VP2-6FGG256C
Manufacturer Part Number	XC2VP2-6FGG256C	Category	Integrated Circuits (ICs)
Manufacturer	Xilinx	Description	IC FPGA 140 I/O 256FGBGA
Package / Case		Quantity Available	2899 pcs
Voltage - Supply	1.425 V ~ 1.575 V	Total RAM Bits	221184
Supplier Device Package	256-FBGA (17x17)	Series	Virtex®-II Pro
Package / Case	256-BGA	Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	3168	Number of LABs/CLBs	352
Number of I/O	140	Mounting Type	Surface Mount
Moisture Sensitivity Level (MSL)	3 (168 Hours)	Manufacturer Standard Lead Time	10 Weeks
Lead Free Status / RoHS Status	Lead free / RoHS Compliant	Base Part Number	XC2VP2
Download	XC2VP2-6FGG256C PDF - DE.pdf XC2VP2-6FGG256C PDF - FR.pdf XC2VP2-6FGG256C PDF - ES.pdf XC2VP2-6FGG256C PDF - IT.pdf XC2VP2-6FGG256C PDF - KR.pdf

Product Model

XC2VP2-6FGG256C

Introduction

High-performance FPGA designed for embedded systems

Brand and Manufacturer

Xilinx

Features

352 LABs/CLBs

3168 Logic Elements/Cells

221184 Total RAM Bits

140 Number of I/O

Surface Mount Mounting Type

Product Performance

Supports voltage range 1.425V to 1.575V

Operating Temperature 0°C to 85°C

Technical Specifications

Embedded FPGA

Obsolete Product Status

Voltage - Supply 1.425V ~ 1.575V

Operating Temperature 0°C ~ 85°C (TJ)

Package / Case 256-BGA

Supplier Device Package 256-FBGA (17x17)

Dimensions, Shape, and Packaging

256-BGA package

Dimension details in 17x17 FBGA format

Quality and Reliability

Designed for reliable operation within specified temperature and voltage ranges

Product Advantages

High integration of logic elements for complex designs

Compact package suitable for space-constrained applications

Product Competitiveness

Optimized for advanced embedded processing with high logic and RAM capacity

Compatibility

Compatible with standard surface mount technology and FPGA programming tools

Standard Certification and Compliance

Complies with industry standard specifications for FPGAs

Lifespan and Sustainability

Built to endure extended lifecycle in embedded applications

Actual Application Fields

Used in telecommunications, automotive, defense, and industrial applications

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