On April 19, 2026 (local time), media reports citing sources familiar with the matter revealed that Google, a subsidiary of Alphabet, is in talks with...

According to *The Business Times*, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot production line began delivering equipment to its R&D team in Febr...

On April 6 local time, U.S. artificial intelligence (AI) technology giant Anthropic announced that it has signed a new agreement with Google and Broad...

On April 1, Microsoft announced it would invest $5.5 billion in Singapore to continue expanding its cloud and artificial intelligence (AI) infrastruct...

Samsung Electronics will be the first to exclusively supply its next-generation HBM4 to OpenAI, the world’s largest artificial intelligence (AI) comp...

Bluetooth® Xpress Modules and Development PlatformSilicon Labs’ Blue Gecko Xpress BGX13 is a wireless Xpress module specially designed to make addin...

EFR32™ Flex Gecko Sub-GHz and 2.4 GHz Proprietary Wireless Starter Kits Silicon Labs' EFR32 Flex Ge...

Wi-Fi Development Kit for the Zentri AMW007-E03 Module Silicon Lab's AMW007 development kit helps us...

Si3404 and Si3406x Power over Ethernet (PoE) Powered Device Chips Silicon Labs’ Si3404 and Si3406x ...

Si86xx Digital Isolators Family Silicon Labs’ digital isolators offer support for up to 5 kV reinfo...