EP4CE75F23C8
Part Number EP4CE75F23C8
Manufacturer Intel
Description IC FPGA 292 I/O 484FBGA
Quantity Available 10200 pcs new original in stock.
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Datasheets 1.EP4CE75F23C8.pdf2.EP4CE75F23C8.pdf3.EP4CE75F23C8.pdf4.EP4CE75F23C8.pdf
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Technical Information of EP4CE75F23C8
Manufacturer Part Number EP4CE75F23C8 Category Integrated Circuits (ICs)
Manufacturer Intel Description IC FPGA 292 I/O 484FBGA
Package / Case 484-FBGA (23x23) Quantity Available 10200 pcs
Voltage - Supply 1.15V ~ 1.25V Total RAM Bits 2810880
Supplier Device Package 484-FBGA (23x23) Series Cyclone® IV E
Package / Case 484-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 75408
Number of LABs/CLBs 4713 Number of I/O 292
Mounting Type Surface Mount Base Product Number EP4CE75
DownloadEP4CE75F23C8 PDF - DE.pdf

Manufacturer Part Number

EP4CE75F23C8

Description

Cyclone IV E FPGA from Intel. 292 user I/O pins, 75408 logic elements, 2,810,880 bits of embedded memory (RAM). Housed in a 484-ball fine-pitch BGA package (23x23mm). Surface mount design, optimized for mid-range applications. Tray packaging, active product status, and 10,100 pieces in stock.

Specifications

Family/Series: Cyclone IV E

Logic Elements/Cells: 75,408

Logic Array Blocks (LABs/CLBs): 4,713

Total RAM Bits: 2,810,880

User I/O Pins: 292

Supply Voltage: 1.15V to 1.25V

Operating Temperature: 0°C to 85°C (TJ)

Package: 484-ball FBGA, 23mm × 23mm, surface mount

Moisture Sensitivity Level: 3 (168 hours floor life)

RoHS Status: Non-compliant

REACH Status: Unaffected

ECCN: 3A991D

HTSUS Code: 8542.39.0001

Device Structure

Uses a 484-ball Fine-pitch Ball Grid Array for physical packaging. Internal structure consists of 4,713 logic array blocks and 75,408 logic elements for flexible digital logic implementation. Embedded RAM integrated for on-chip data storage. Up to 292 user-configurable input/output pins.

Performance Characteristics

Reliable operation from 0°C to 85°C. Fast logic speeds thanks to high number of logic elements. Large system integration capacity for embedded memory and I/O. Low core voltage helps reduce power consumption. Supports high-density designs for mid-range FPGAs.

Application Environments

Best for industrial controls, communication base stations, consumer electronics, automotive systems, and industrial automation. Suitable for designs needing flexible logic design, medium-to-large resource capacity, and moderate performance requirements. Can be used in prototyping and production environments.

Selection Guidelines

Choose this model if your application needs:

Up to 75,408 logic elements

Nearly 3Mbits of RAM

Around 300 user I/O pins

Moderate speed and low power demands

Surface-mount packaging in medium size

Compatibility with Cyclone IV E family toolchains

Verify RoHS requirements, as this version is not RoHS compliant.

Usage Considerations

Follow moisture sensitivity precautions (MSL 3, 168 hours). Ensure proper surface-mount processes for FBGA. Check voltage supply (1.15V to 1.25V) matches system power rails. Ensure operating temperature range fits your application. Not RoHS compliant—use only in markets or products where that’s allowed. Compatible with most standard Cyclone IV E development tools.

Potential Equivalent/Replacement Models

This part may have alternative versions with different I/O counts, package types, or RoHS compliance. For example, other EP4CE75Fxx models (such as EP4CE75F23C7N for RoHS compliant options) might serve as equivalents if pinout and specs match your needs.

If you need direct drop-in replacements or specific alternates, please contact the Ariat-Tech sales team for detailed support and up-to-date compatible model lists.

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