| EP4CE75F23C8 | |
|---|---|
| Part Number | EP4CE75F23C8 |
| Manufacturer | Intel |
| Description | IC FPGA 292 I/O 484FBGA |
| Quantity Available | 10200 pcs new original in stock. Request Stock & Quotation |
| Datasheets | 1.EP4CE75F23C8.pdf2.EP4CE75F23C8.pdf3.EP4CE75F23C8.pdf4.EP4CE75F23C8.pdf |
| Download | EP4CE75F23C8 Details PDF |
| EP4CE75F23C8 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of EP4CE75F23C8 | |||
|---|---|---|---|
| Manufacturer Part Number | EP4CE75F23C8 | Category | Integrated Circuits (ICs) |
| Manufacturer | Intel | Description | IC FPGA 292 I/O 484FBGA |
| Package / Case | 484-FBGA (23x23) | Quantity Available | 10200 pcs |
| Voltage - Supply | 1.15V ~ 1.25V | Total RAM Bits | 2810880 |
| Supplier Device Package | 484-FBGA (23x23) | Series | Cyclone® IV E |
| Package / Case | 484-BGA | Package | Tray |
| Operating Temperature | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells | 75408 |
| Number of LABs/CLBs | 4713 | Number of I/O | 292 |
| Mounting Type | Surface Mount | Base Product Number | EP4CE75 |
| Download | EP4CE75F23C8 PDF - DE.pdf | ||
EP4CE75F23C8
Cyclone IV E FPGA from Intel. 292 user I/O pins, 75408 logic elements, 2,810,880 bits of embedded memory (RAM). Housed in a 484-ball fine-pitch BGA package (23x23mm). Surface mount design, optimized for mid-range applications. Tray packaging, active product status, and 10,100 pieces in stock.
Family/Series: Cyclone IV E
Logic Elements/Cells: 75,408
Logic Array Blocks (LABs/CLBs): 4,713
Total RAM Bits: 2,810,880
User I/O Pins: 292
Supply Voltage: 1.15V to 1.25V
Operating Temperature: 0°C to 85°C (TJ)
Package: 484-ball FBGA, 23mm × 23mm, surface mount
Moisture Sensitivity Level: 3 (168 hours floor life)
RoHS Status: Non-compliant
REACH Status: Unaffected
ECCN: 3A991D
HTSUS Code: 8542.39.0001
Uses a 484-ball Fine-pitch Ball Grid Array for physical packaging. Internal structure consists of 4,713 logic array blocks and 75,408 logic elements for flexible digital logic implementation. Embedded RAM integrated for on-chip data storage. Up to 292 user-configurable input/output pins.
Reliable operation from 0°C to 85°C. Fast logic speeds thanks to high number of logic elements. Large system integration capacity for embedded memory and I/O. Low core voltage helps reduce power consumption. Supports high-density designs for mid-range FPGAs.
Best for industrial controls, communication base stations, consumer electronics, automotive systems, and industrial automation. Suitable for designs needing flexible logic design, medium-to-large resource capacity, and moderate performance requirements. Can be used in prototyping and production environments.
Choose this model if your application needs:
Up to 75,408 logic elements
Nearly 3Mbits of RAM
Around 300 user I/O pins
Moderate speed and low power demands
Surface-mount packaging in medium size
Compatibility with Cyclone IV E family toolchains
Verify RoHS requirements, as this version is not RoHS compliant.
Follow moisture sensitivity precautions (MSL 3, 168 hours). Ensure proper surface-mount processes for FBGA. Check voltage supply (1.15V to 1.25V) matches system power rails. Ensure operating temperature range fits your application. Not RoHS compliant—use only in markets or products where that’s allowed. Compatible with most standard Cyclone IV E development tools.
This part may have alternative versions with different I/O counts, package types, or RoHS compliance. For example, other EP4CE75Fxx models (such as EP4CE75F23C7N for RoHS compliant options) might serve as equivalents if pinout and specs match your needs.
If you need direct drop-in replacements or specific alternates, please contact the Ariat-Tech sales team for detailed support and up-to-date compatible model lists.
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| EP4CE75F23C8 Image | EP4CE75F23C8 Picture | EP4CE75F23C8 PDF | |||
| EP4CE75F23C8 Datasheet | Download EP4CE75F23C8 Datasheet | Manufacturer Intel | |||
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