Manufacturer Part Number

EP4CE75F23C6

Description

The EP4CE75F23C6 is an FPGA from Intel’s Cyclone IV E series. It supports 292 user I/Os, offers high logic density with 75,408 logic elements, and comes in a 484-ball FBGA surface mount package. It features 2,810,880 RAM bits, suitable for medium to large digital logic designs. The device is made for use in embedded or industrial applications and is RoHS compliant, ensuring alignment with environmental regulations. The product is available as new original stock and not refurbished.

Specifications

Series: Cyclone IV E

Logic Elements/Cells: 75,408

LABs/CLBs: 4,713

Total RAM: 2,810,880 bits

User I/Os: 292

Supply Voltage: 1.15V to 1.25V

Operating Temperature: 0°C to 85°C (Tj)

Mounting: Surface mount

Package: 484-ball FBGA (23x23 mm)

Moisture Sensitivity Level: MSL 3 (168 hours)

RoHS Status: Compliant

REACH Status: Unaffected

ECCN/HTS/Code: 3A991D / 8542.39.0001

Product Status: Active

Device Structure

The device integrates 75,408 programmable logic elements, 4,713 logic array blocks, and embedded memory blocks summing to 2.8 Mbits, all interconnected via a high-speed routing matrix. The 484-FBGA package provides robust signal integrity and thermal performance. It features a dense and scalable architecture, optimized for mid-sized applications requiring high I/O count and logic resources.

Performance Characteristics

High logic capacity supports demanding algorithms and designs

292 user I/O pins for flexible interface options

On-chip memory enhances data buffering and processing

Fast reconfiguration, power-efficient operation

Operating temperature up to 85°C enables use in industrial environments

Application Environments

Industrial automation controllers

Video and image processing systems

Communications protocols, hardware acceleration

Consumer/industrial electronics, automotive, medical devices

Any system needing high I/O count and moderate logic/memory density

Selection Guidelines

Choose this model if you require up to 75,408 logic elements, a large number of I/Os, and over 2.8 Mbits of embedded RAM. The 484-BGA package is ideal for high-density, space-constrained PCBs. If your application needs higher performance, more logic, or lower power, compare with higher-end or newer FPGA families. Consider supply voltage, MSL, and operating temperature to match with your board design and environment.

Usage Considerations

Must be handled in ESD-safe environment to prevent device damage

Follow JEDEC moisture sensitivity requirements (MSL 3 — 168 hours out of dry pack)

Design PCB for 484-BGA footprint (23x23mm) and proper power/ground distribution

Verify voltage supply range (1.15V to 1.25V) before application

Use compatible development tools for configuration and programming

Ensure sufficient thermal management if operating near temperature limits

Potential Equivalent/Replacement Models

Cyclone IV E alternatives: EP4CE75F23I7, EP4CE75F29C7 (different temperature grades or packages)

Potential alternatives from Cyclone V: 5CEFA7F23C8N

For the closest drop-in equivalents, check same family with different speed/temperature grades (e.g., EP4CE75F23I6)

Alternate FPGAs from Lattice (ECP5 series), Xilinx (Artix-7 series) may serve, but require board redesign and tool chain changes

If an exact or close equivalent is not listed, or if you want help with pin-to-pin or package compatibility, please contact the Ariat-Tech sales team for expert assistance.

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