Manufacturer Part Number

EP3SL340H1152C2N

Description

Field-Programmable Gate Array (FPGA) from Intel’s Stratix III L series. Features 744 general-purpose I/O pins and is provided in a 1152-ball Fine-pitch Ball Grid Array (FCBGA) package. Designed for high-performance embedded logic functions with rich system integration. The series is known for speed and efficiency, suitable for demanding computing environments.

Specifications

Series: Stratix III L

Number of LABs/CLBs: 13,500

Number of Logic Elements/Cells: 337,500

Total Built-In RAM Bits: 18,822,144

Number of I/O Pins: 744

Supply Voltage Range: 0.86V to 1.15V

Mounting Type: Surface Mount

Operating Temperature Range: 0°C to 85°C (TJ)

Package / Case: 1152-BBGA, FCBGA (40x40 mm)

RoHS Status: RoHS Compliant

MSL: Level 3 (168 Hours)

ECCN: 3A001A2C

HTSUS: 8542.39.0001

Product Status: Obsolete

Device Structure

This FPGA uses a fine-pitch BGA surface-mount packaging and implements logic fabric with 13,500 Logic Array Blocks (LABs/CLBs). It supports high-density integration with 337,500 logic elements and extensive on-chip RAM resources. Architecture supports advanced programmable features and high I/O count for complex designs.

Performance Characteristics

High logic density supports complex logic design and high computing throughput

Fast clock speeds and optimized performance for embedded and communication systems

Supports wide voltage supply range, improving flexibility and compatibility

Large I/O count enables flexible system integration

Efficient power management and thermal characteristics within 0°C to 85°C junction temperature

Application Environments

High-performance embedded systems

Communications infrastructure (e.g., networking switches, base stations)

Data processing and high-speed computing platforms

Military, aerospace, and industrial systems requiring extended I/O and logic density

Prototyping and hardware acceleration applications

Selection Guidelines

Best for users needing very high logic density and large RAM

Suitable when a high number of I/O pins is required

Ideal for surface mount assembly on PCBs with large FPGA footprints

Choose only if compatibility with the 1152-HBGA package and voltage requirements is ensured

Should not be selected for new designs due to its obsolete status; verify long-term support

Usage Considerations

Handle with care as MSL 3 (can be exposed to room humidity for only up to 168 hours before soldering)

Ensure proper thermal management and supply voltage regulation

Design must match the 0°C to 85°C operating temperature

Confirm hardware and software tool compatibility with Stratix III L devices

Obsolete status means limited support and lifecycle—evaluate risks for long-term use

Potential Equivalent/Replacement Models

There is a substitute: EP3SL340H1152C2G, which should be considered for functionally similar requirements. If more alternatives are needed or the mentioned substitute does not meet your requirements, please contact the Ariat-Tech sales team via our website for detailed guidance and to explore other compatible or equivalent devices.

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