EP3SL340H1152C2G
Part Number EP3SL340H1152C2G
Manufacturer Intel
Description IC FPGA 744 I/O 1152HBGA
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Datasheets
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Technical Information of EP3SL340H1152C2G
Manufacturer Part Number EP3SL340H1152C2G Category Integrated Circuits (ICs)
Manufacturer Intel Description IC FPGA 744 I/O 1152HBGA
Package / Case Tray Quantity Available Available Stock
Series * Package Tray
Base Product Number EP3SL340  

Manufacturer Part Number

EP3SL340H1152C2G

Description

This is a high-density Field Programmable Gate Array (FPGA) IC from Intel. It supports up to 744 input/output ports and uses a 1152-ball Heterogeneous Ball Grid Array (HBGA) package. The device is designed for embedded system applications needing advanced logic performance and customization.

Specifications

Series: Not specified

I/O Ports: 744

Package: 1152HBGA

RoHS Status: Compliant

Moisture Sensitivity Level (MSL): 3, with a floor life of 168 hours

Programmability: Digital logic not explicitly verified

REACH Status: Unaffected

Inventory: 986 pieces in stock, new and original

Device Structure

Uses a Ball Grid Array package with 1152 balls, providing a compact and robust structure for high-pin-count integration.

Based on Intel's FPGA architecture, tailored for embedded systems requiring scalable logic resources and flexibility.

Performance Characteristics

Delivers high-speed logic processing and broad I/O flexibility.

Supports complex programmable applications and can be configured for a variety of digital logic functions.

Optimized for reliable operation in demanding embedded environments.

Application Environments

Suitable for telecommunications, industrial automation, networking infrastructure, and advanced embedded processing.

Perfect for custom digital processing needs, rapid prototyping, and acceleration of data flows in hardware.

Selection Guidelines

Select this model if you require high I/O count, advanced logic customization, and robust packaging for demanding applications.

Ensure compatibility with your system's voltage, board layout, and required logic resources.

Check for long-term RoHS and REACH environmental compliance.

Consider moisture sensitivity during storage and manufacturing.

Usage Considerations

Observe the MSL 3 rating to avoid moisture-related packaging issues.

Handle with care to prevent static discharge and physical damage to the HBGA package.

Use recommended programming and configuration tools for Intel FPGAs.

Verify voltage and cooling requirements in your design.

Potential Equivalent/Replacement Models

If equivalent or alternative models are available, consider Intel EP3SL340 family variants with different speeds, power profiles, or package options (EP3SL340H1152C4G, EP3SL340F1152C2G, etc).

Check similar FPGAs from Intel offering comparable logic capacity and I/O counts.

If no direct equivalents are found, contact the Ariat-Tech sales team for expert advice or availability of recommended alternatives.

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