Manufacturer Part Number

M2S050TS-VF400

Description

This is a System-On-Chip (SOC) IC combining an ARM Cortex-M3 processor and SmartFusion2 FPGA technology. It runs at up to 166MHz and integrates 50K FPGA logic modules. The chip comes in a 400-ball plastic VFBGA package measuring 17x17mm. It is designed for embedded applications needing high security, mixed signal processing, and flexible I/O options.

Specifications

ARM Cortex-M3 core, up to 166MHz

FPGA with 50K logic modules

256KB embedded Flash memory

64KB embedded RAM

Peripherals include DDR memory interface, PCIe support, and SERDES

Connectivity supports CANbus, Ethernet, I2C, SPI, UART/USART, and USB

207 programmable I/O pins

Operating temperature range: 0°C to 85°C (junction temperature)

400-VFBGA (17x17mm) package

RoHS non-compliant, MSL 3 (168 Hours), REACH unaffected

HTSUS: 8542.39.0001, ECCN: 3A991D

Device Structure

Integrates both microcontroller and FPGA on one chip

ARM Cortex-M3 processor handles general processing tasks

FPGA section allows for hardware customization and parallel processing

On-chip Flash and RAM for code and data storage

Dedicated interfaces for DDR, PCIe, and SERDES

400-ball VFBGA package provides high-density connections and compact size

Performance Characteristics

Runs at up to 166MHz—fast execution for embedded applications

FPGA with 50K logic blocks for flexible and powerful logic implementation

Low-latency communication between FPGA and MCU blocks

Supports numerous I/O and connectivity standards

Reliable performance within specified temperature (0°C to 85°C)

Efficient power utilization in embedded systems

Application Environments

Industrial automation

Aerospace and defense

Communications infrastructure

Medical devices

Secure embedded control systems

Network security

Data acquisition and sensor fusion

Power management

Selection Guidelines

Choose for applications needing both MCU flexibility and FPGA reconfigurability

Ensure the required number of I/Os (207) and logic capacity (50K blocks)

Verify package and temperature range for your environment

Check compatibility with your required interfaces (DDR, PCIe, CAN, Ethernet, USB, etc.)

Consider compliance needs (RoHS, REACH, ECCN)

Usage Considerations

Proper handling for Moisture Sensitivity Level 3—reflow within 168 hours after opening dry pack

Non-compliance with RoHS regulations—review for use in regions requiring RoHS

Make sure your system can use a BGA package (requires precise PCB design and assembly)

FPGA programming and MCU configuration require design tools from Microchip

Take note of thermal dissipation for high-speed and intensive logic use

Potential Equivalent/Replacement Models

There are alternative SmartFusion2 models with different logic capacities and package options, such as:

M2S025TS-VF256 (less logic, smaller package)

M2S060TS-VF400 (more logic)

M2S090TS-VF400 (even higher logic module count)

M2S050-FG484 (different package)

If you need equivalents from a different brand, similar products may be available in Lattice’s ECP5 or Xilinx’s Zynq-7000 families, though you must check specific matching features.

If exact alternatives are not suitable, or you need more help, contact our Ariat-Tech sales team for assistance and recommendations tailored to your application.

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