ATSAM4CMP8CC-AU
Part Number ATSAM4CMP8CC-AU
Manufacturer Microchip Technology
Description IC MCU 32BIT 512KB FLASH 100LQFP
Quantity Available 40300 pcs new original in stock.
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Datasheets 1.ATSAM4CMP8CC-AU.pdf2.ATSAM4CMP8CC-AU.pdf3.ATSAM4CMP8CC-AU.pdf4.ATSAM4CMP8CC-AU.pdf5.ATSAM4CMP8CC-AU.pdf6.ATSAM4CMP8CC-AU.pdf
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Technical Information of ATSAM4CMP8CC-AU
Manufacturer Part Number ATSAM4CMP8CC-AU Category Integrated Circuits (ICs)
Manufacturer Micrel / Microchip Technology Description IC MCU 32BIT 512KB FLASH 100LQFP
Package / Case 100-LQFP (14x14) Quantity Available 40300 pcs
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V Supplier Device Package 100-LQFP (14x14)
Speed 120MHz Series SAM4CM
RAM Size 128K x 8 Program Memory Type FLASH
Program Memory Size 512KB (512K x 8) Product Status Active
Peripherals Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Package / Case 100-LQFP
Package Tray Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA) Number of I/O 52
Mounting Type Surface Mount EEPROM Size -
Data Converters A/D 6x10b Core Size 32-Bit Dual-Core
Core Processor ARM® Cortex®-M4/M4F Connectivity EBI/EMI, I²C, IrDA, SPI, UART/USART
Base Product Number ATSAM4CM  
DownloadATSAM4CMP8CC-AU PDF - DE.pdf

Manufacturer Part Number

ATSAM4CMP8CC-AU

Description

This product is a 32-bit microcontroller IC from Microchip Technology, part of the SAM4CM series. It features a dual-core ARM Cortex-M4/M4F running at 120MHz, with 512KB of on-chip Flash memory. The device comes in a 100-pin LQFP package (14x14mm), is designed for embedded applications, and supports various connectivity interfaces such as EBI/EMI, I2C, IrDA, SPI, UART/USART. Peripherals include DMA, LCD controller, PWM controllers, watchdog timer, brown-out detect/reset, and power-on reset. The device has 52 general-purpose I/O pins.

Specifications

Core Processor: ARM Cortex-M4/M4F, 32-bit Dual-Core

Maximum Speed: 120MHz

Program Memory: 512KB Flash

RAM: 128KB

Data Converters: 6-channel, 10-bit ADC

Operating Voltage: 1.62V to 3.6V

Operating Temperature: -40°C to +85°C

I/O Pins: 52

Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART

Peripherals: DMA, LCD, PWM, Watchdog Timer, Brown-out Detect, POR

Package: 100-LQFP (14x14mm), Surface mount

MSL: Level 3 (168 hours)

RoHS: ROHS3 Compliant

REACH: Unaffected

ECCN: 5A992C

HTSUS: 8542.31.0025

Device Structure

The microcontroller includes two ARM Cortex-M4 cores, a range of connectivity modules, data converters, and many integrated peripherals. It is based on Harvard architecture for high performance. The cores run at 120MHz and share 128KB RAM and 512KB Flash. All modules are integrated onto a single silicon die and packed in a flat quad 100-pin LQFP package with surface-mount leads.

Performance Characteristics

High processing speed (up to 120MHz dual-core operation) for real-time embedded control

Large Flash memory (512KB) and RAM (128KB) for complex firmware and multitasking

Multiple high-speed serial and parallel communication ports

Six 10-bit ADC channels for analog signal interfacing

Integrated DMA allows fast, efficient data transfer

Power-on reset, brown-out detector, and watchdog timer enable robust operation in noisy environments

52 general-purpose I/Os for flexible connectivity

Application Environments

Smart metering solutions (electric, water, gas meters)

Industrial automation and control systems

Power monitoring and smart grid devices

Consumer and white goods

Embedded system controllers where dual-core, high performance, and reliability are required

Applications requiring a broad operating temperature range (-40°C to +85°C)

Selection Guidelines

Choose this part for high-performance embedded applications requiring dual-core processing

Suitable for projects needing up to 512KB Flash and 128KB RAM with advanced peripherals

Ideal if multiple communication interfaces or analog inputs are needed

Ensure the system voltage is between 1.62V and 3.6V

Surface-mount assembly required due to 100-LQFP package

Fits designs requiring RoHS compliance and temperature resilience

Usage Considerations

Observe maximum ratings to avoid device damage

Moisture sensitivity level (MSL 3) means parts need to be mounted within 168 hours after opening dry pack

Use an appropriate thermal profile during reflow soldering to avoid package or solder failures

Implement ESD protection on unused or external I/O pins

Ensure sufficient PCB routing for 100 leads and adequate power supply decoupling

Validate peripheral pin assignments and alternate functions during PCB design

Heavy computational and memory resource usage may require code optimization for dual-core

Flash endurance and RAM retention constraints must be considered during product lifespan estimation

Potential Equivalent/Replacement Models

No direct drop-in replacements are mentioned for ATSAM4CMP8CC-AU.

Possible alternatives within the SAM4CM series (with different memory, packaging, or performance) may exist, such as ATSAM4CMP16CC-AU, ATSAM4CMP32CC-AU, or other SAM4CM variants, but exact compatibility should be confirmed based on application requirements and pinout.

For equivalent or alternative devices, it is recommended to contact Ariat-Tech sales team for the latest cross-reference and availability support.

If you need help finding an exact or suitable equivalent, contact the Ariat-Tech sales team for expert assistance.

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