Manufacturer Part Number

S34ML02G100BHB003

Description

2Gbit FLASH NAND memory IC with parallel interface. Packaged in a 63-ball very fine ball grid array (VFBGA), measuring 11mm x 9mm. Suitable for high-capacity data storage applications. End-of-life status at major distributors, but remaining stock available. Delivers fast write cycles and designed for reliable non-volatile data storage.

Specifications

Memory Type: Non-Volatile

Memory Format: FLASH

Technology: NAND

Capacity: 2 Gigabit (2Gb)

Organization: 256 Meg x 8 bit

Memory Interface: Parallel

Write Cycle Time (Word/Page): 25 nanoseconds

Operating Voltage: 2.7V to 3.6V

Operating Temperature Range: -40°C to +105°C

Package Type: 63-VFBGA (11mm x 9mm, surface mount)

Moisture Sensitivity Level (MSL): 3 (168 hours)

RoHS Status: RoHS3 Compliant

REACH Status: REACH unaffected

ECCN Code: 3A991B1A

HTSUS: 8542.32.0071

Device Structure

Uses NAND-type flash memory cell arrays

Organized for 256M x 8 parallel access

Packaged in a 63-ball VFBGA which allows compact, high-density mounting on PCBs

Designed for surface-mount soldering in automated assembly lines

Performance Characteristics

High density and storage capabilities at 2Gb per chip

Fast data access due to 25ns page/word write cycle time

Reliable operation across extended temperature range (-40°C to 105°C)

Designed for long data retention and endurance typical of NAND technology

Low power operating range (2.7V – 3.6V) suitable for battery-powered devices

Supports parallel interface for fast read/write operations

Application Environments

Consumer electronics such as cameras, MP3 players, and GPS units

Industrial and automotive applications due to wide temperature support

Embedded systems requiring non-volatile storage

Networking, routers, and set-top boxes needing reliable flash storage

Medical and measurement devices with rugged environment demands

Selection Guidelines

Choose if high-density, reliable flash memory is required

Verify device supports parallel NAND memory interface

Check PCB layout for compatibility with 63-ball VFBGA package (11x9 mm)

Ensure operating voltage and temperature match application needs

Consider availability: recommended for legacy or ongoing but not new designs due to discontinued status

For new designs, review possible replacement models listed below

Usage Considerations

Handle and store following MSL 3 guidelines (168h at 30°C, 60% RH)

Confirm device programming methods and ECC (error correction code) compatibilities

Check for compatibility with existing controllers or microprocessors

Take extra care during soldering to avoid heat damage to VFBGA package

Obsolete at some distributors—verify sufficient lifecycle support or consider replacements

Potential Equivalent/Replacement Models

There are alternative models available for this device:

MT29F2G08ABAEAH4-AITX:E TR (Micron Technology)

MT29F2G08ABAEAH4-AITX:E (Micron Technology)

If these do not meet your project needs, or further compatibility advice is required, please contact the Ariat-Tech sales team for more information and tailored support.

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