EP2S15F484C4
Part Number EP2S15F484C4
Manufacturer Altera
Description IC FPGA 342 I/O 484FBGA
Quantity Available 2508 pcs new original in stock.
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Datasheets 1.EP2S15F484C4.pdf2.EP2S15F484C4.pdf3.EP2S15F484C4.pdf
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Technical Information of EP2S15F484C4
Manufacturer Part Number EP2S15F484C4 Category Integrated Circuits (ICs)
Manufacturer Altera Description IC FPGA 342 I/O 484FBGA
Package / Case Quantity Available 2508 pcs
Voltage - Supply 1.15 V ~ 1.25 V Total RAM Bits 419328
Supplier Device Package 484-FBGA (23x23) Series Stratix® II
Package / Case 484-BBGA, FCBGA Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 15600 Number of LABs/CLBs 780
Number of I/O 342 Mounting Type Surface Mount
DownloadEP2S15F484C4 PDF - DE.pdf

Product Model


EP2S15F484C4

Introduction


High-density Programmable Logic Device

Brand and Manufacturer


Intel

Features


Embedded FPGA core for custom logic

780 Logic Array Blocks (LABs)

15600 Logic Elements/Cells

Total 419328 RAM Bits

342 Input/Output ports

Product Performance


Operates within voltage supply range 1.15V to 1.25V

Supports a surface mount technology

Technical Specifications


LABs/CLBs: 780

Logic Elements/Cells: 15600

Total RAM Bits: 419328

Number of I/O: 342

Voltage Supply: 1.15V ~ 1.25V

Dimensions, Shape, and Packaging


484-Ball Fine-Pitch Ball Grid Array (484-FBGA)

Square 23x23 mm package size

Quality and Reliability


Designed to meet high-performance standards

Operates at 0°C to 85°C junction temperature range

Product Advantages


Offers a balanced mix of density, performance, and power

Flexible logic resources for complex designs

Product Competitiveness


Part of the Stratix® II series known for high performance

Compatibility


Supports surface mount compatible systems

Standard Certification and Compliance


Complies with industry standards for embedded FPGAs

Lifespan and Sustainability


Defined by the selected process node's durability and Intel's manufacturing

Actual Application Fields


Used in high-speed digital processing, communications, and industrial applications

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