| STM32WB55CGU6TR | |
|---|---|
| Part Number | STM32WB55CGU6TR |
| Manufacturer | STMicroelectronics |
| Description | ULTRA-LOW-POWER DUAL CORE ARM CO |
| Quantity Available | 7915 pcs new original in stock. Request Stock & Quotation |
| Datasheets | 1.STM32WB55CGU6TR.pdf2.STM32WB55CGU6TR.pdf3.STM32WB55CGU6TR.pdf4.STM32WB55CGU6TR.pdf5.STM32WB55CGU6TR.pdf6.STM32WB55CGU6TR.pdf |
| STM32WB55CGU6TR Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of STM32WB55CGU6TR | |||
|---|---|---|---|
| Manufacturer Part Number | STM32WB55CGU6TR | Category | RF and Wireless |
| Manufacturer | STMicroelectronics | Description | ULTRA-LOW-POWER DUAL CORE ARM CO |
| Package / Case | 48-UFQFPN (7x7) | Quantity Available | 7915 pcs |
| Voltage - Supply | 1.71V ~ 3.6V | Type | TxRx + MCU |
| Supplier Device Package | 48-UFQFPN (7x7) | Series | STM32WB |
| Serial Interfaces | ADC, I²C, SPI, UART, USART, USB | Sensitivity | -100dBm |
| RF Family/Standard | 802.15.4, Bluetooth | Protocol | Bluetooth v5.3, Thread, Zigbee® |
| Power - Output | 6dBm | Package / Case | 48-UFQFN Exposed Pad |
| Package | Tape & Reel (TR) | Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Modulation | GFSK |
| Memory Size | 1MB Flash, 256kB SRAM | GPIO | 30 |
| Frequency | 2.405GHz ~ 2.48GHz | Data Rate (Max) | 2Mbps |
| Current - Transmitting | 5.2mA ~ 12.7mA | Current - Receiving | 4.5mA ~ 7.9mA |
| Base Product Number | STM32 |
STM32WB55CGU6TR
Ultra-low-power dual-core ARM Cortex-M4 and Cortex-M0+ wireless microcontroller unit. Supports RF transmission and reception with embedded MCU. Built for 802.15.4, Bluetooth v5.3, Thread, and Zigbee® protocols in the 2.405GHz–2.48GHz band. Provides robust wireless communication and efficient processing in a 48-UFQFN exposed pad package. Includes 1MB Flash, 256kB SRAM, with advanced peripherals for connectivity and low power consumption, suited for IoT and wireless networking applications.
Wireless Standards: 802.15.4, Bluetooth v5.3, Thread, Zigbee®
Modulation: GFSK
Frequency Range: 2.405GHz to 2.48GHz
Maximum Data Rate: 2Mbps
Output Power: up to 6dBm
Sensitivity: -100dBm
Flash Memory: 1MB
SRAM: 256kB
Serial Interfaces: ADC, I2C, SPI, UART, USART, USB
GPIO: 30
Supply Voltage: 1.71V to 3.6V
Receive Current: 4.5mA ~ 7.9mA
Transmit Current: 5.2mA ~ 12.7mA
Operating Temperature: -40°C to +85°C
Mounting Type: Surface mount, 48-UFQFPN (7x7) package
RoHS Compliance: ROHS3 Compliant
MSL: 3 (168 Hours)
REACH: Unaffected
Integrates dual ARM cores (Cortex-M4 for application processing and Cortex-M0+ for network processing) in a monolithic IC. RF transceiver and MCU are combined on a single chip. 48-pin UFQFN package features an exposed pad for better heat dissipation and reliable mounting. Includes embedded security features and multiple serial interface modules.
Delivers high wireless data rates up to 2Mbps. Achieves ultra-low power operation, ideal for battery-based systems. Offers wide operating temperature range and high sensitivity for robust RF communication. Up to 6dBm output power ensures good transmission distance. Fast wake-up and low RF/MCU active current extend battery life in portable IoT nodes.
Best suited for IoT devices such as smart home hubs, connected sensors, healthcare monitors, industrial automation, wearable electronics, and wireless mesh networks. Supports Bluetooth Low Energy, Thread, and Zigbee protocols, making it ideal for interoperable and low-power wireless networks in homes, buildings, and commercial environments.
Choose STM32WB55CGU6TR for applications needing dual-protocol wireless support and significant on-chip memory. Recommend for projects requiring integration of Bluetooth v5.3, Zigbee, and Thread without extra coprocessors. Well-matched for designs prioritizing low power, small footprint, and secure wireless communication.
Ensure operating voltage (1.71V–3.6V) and package thermal dissipation align with your design. Observe ESD handling protocols and proper PCB layout for the 48-UFQFN exposed pad. Consider the device's MSL (Moisture Sensitivity Level 3) during assembly—process within 168 hours once removed from dry packaging. Optimize antenna and power supply decoupling for best RF performance.
Equivalent or alternative models may be available in the STM32WB family, such as:
STM32WB55RGV6
STM32WB55RGV6TR
STM32WB55CEU6
STM32WB50CGU6TR
STM32WB55CCU6
STM32WB5MMGH6TR (module version with similar capabilities)
Other models may differ in available GPIO, package, or memory size—please compare specifications directly.
If you need more alternatives, contact the Ariat-Tech sales team on our website for further help.
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| STM32WB55CGU6TR Image | STM32WB55CGU6TR Picture | STM32WB55CGU6TR PDF | |||
| STM32WB55CGU6TR Datasheet | Download STM32WB55CGU6TR Datasheet | Manufacturer | |||
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