Manufacturer Part Number

TMS320C6421ZWT4

Description

Fixed-point Digital Signal Processor (DSP) chip in a 361-ball BGA package. Designed for embedded applications that require efficient digital signal processing. Used in fields like telecommunications, multimedia, and industrial controls. Offers integrated ROM and RAM and supports multiple communication interfaces.

Specifications

400MHz clock speed

64KB internal ROM

96KB on-chip RAM

Core voltage: 1.05V or 1.20V

I/O voltage: 1.8V, 3.3V

Interfaces: HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC

Operating temperature: 0°C to 90°C (junction temp)

RoHS3 compliant, REACH unaffected

Moisture Sensitivity Level: 3 (168 hours)

Package: 361-LFBGA, 16x16 mm outline

Surface mount type

ECCN: 3A991A2

HTSUS: 8542.31.0001

Device Structure

361-ball Low-profile Fine-Pitch Ball Grid Array (LFBGA)

Surface mount for PCB assembly

On-chip memory includes 96KB RAM, 64KB ROM

Integrated peripherals, no external ROM/RAM required for basic functions

Performance Characteristics

Operates at 400MHz, suitable for real-time DSP tasks

Efficient fixed-point processing for audio, video, voice, and signal processing workloads

Low-power operation with selectable core voltages

Supports multiple communication protocols for flexible system integration

Broad temperature range suitable for commercial environments

Application Environments

Telecommunication equipment

Multimedia processing units

Industrial control systems

Embedded networked devices

VoIP and audio processing

DSP applications needing fixed-point arithmetic

Selection Guidelines

Choose this model for applications requiring efficient and reliable fixed-point DSP computation at moderate speeds

Ideal when integration of Ethernet, UART, and audio serial ports is needed

Suitable if space is limited due to compact BGA package

Ensure ROM/RAM sizes meet your code and data requirements

Core and I/O voltage compatibility with the system power supply

Usage Considerations

Observe BGA handling and reflow soldering requirements to avoid assembly issues

Moisture sensitivity level 3 – requires baking or controlled storage once opened

Check system power supply for required core (1.05V/1.20V) and I/O (1.8V/3.3V) voltages

Thermal management may be needed if device operates near max temperature

Proper PCB design critical for signal integrity on high-speed interfaces

Evaluate on-chip memory resources for your application needs; external memory might be necessary for large code/data

Potential Equivalent/Replacement Models

There may be alternative models in the TMS320C642x series with different memory, speed, or feature sets. Example alternatives include:

TMS320C6421ZWT6 (higher clock speed)

TMS320C6420ZWT4

TMS320C6416T series (similar architecture, but check compatibility)

For exact equivalents and migration options, review Texas Instruments’ cross-reference tools or contact our website Ariat-Tech sales team for up-to-date guidance. Newer or pin-compatible models may be available depending on your specific requirements.

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