EP4CE40F29C7
Part Number EP4CE40F29C7
Manufacturer Intel
Description IC FPGA 532 I/O 780FBGA
Quantity Available 208 pcs in stock
Datasheets 1.EP4CE40F29C7.pdf2.EP4CE40F29C7.pdf3.EP4CE40F29C7.pdf4.EP4CE40F29C7.pdf
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Technical Information of EP4CE40F29C7
Manufacturer Part Number EP4CE40F29C7 Category Integrated Circuits (ICs)
Manufacturer Intel Description IC FPGA 532 I/O 780FBGA
Package / Case 780-FBGA (29x29) Quantity Available 208 pcs
Voltage - Supply 1.15V ~ 1.25V Total RAM Bits 1161216
Supplier Device Package 780-FBGA (29x29) Series Cyclone® IV E
Package / Case 780-BGA Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 39600
Number of LABs/CLBs 2475 Number of I/O 532
Mounting Type Surface Mount Base Product Number EP4CE40
DownloadEP4CE40F29C7 PDF - DE.pdf

Manufacturer Part Number

EP4CE40F29C7

Description

FPGA device with 532 input/output pins in a 780-ball grid array. From Intel's Cyclone IV E series, designed for mid-range embedded applications. Produced in tray packaging, RoHS non-compliant. Provides strong programmable logic and ample memory.

Specifications

Manufactured by Intel, series Cyclone IV E. 39600 logic elements. 2475 LABs/CLBs. 1161216 total RAM bits. 532 input/output pins. Supply voltage between 1.15V and 1.25V. Surface-mount technology in a 780-ball grid array package (size 29x29 mm). Operates from 0°C to 85°C junction temperature. Moisture Sensitivity Level (MSL) of 3, meaning 168 hours floor life. REACH compliant, RoHS non-compliant. HTS code: 8542.39.0001. ECCN: 3A001A7A.

Device Structure

Field Programmable Gate Array (FPGA) architecture. Ball Grid Array (BGA) package with 780 pins supports high-density routing. Surface mount design allows for compact PCB assembly. Integrated with high logic density and large embedded RAM blocks. Built for embedded and mid-range applications demanding many I/O and significant logic resources.

Performance Characteristics

Logic elements: 39600. RAM bits: 1161216 for storage and fast access needs. Wide temperature support from 0°C to 85°C. High I/O count at 532 pins enables versatile interfacing. Efficient power consumption with low supply voltage range. Active status ensures ongoing production support.

Application Environments

Best for embedded systems, industrial automation, communications, prototyping, hardware acceleration, digital signal processing, and custom logic circuits. Fits use in systems where moderate to high processing power and large I/O count are required.

Selection Guidelines

Choose this model for designs needing many logic elements and high I/O density. Suitable for medium- to large-size FPGAs. Not recommended for projects needing RoHS-compliance. Make sure to check thermal design and voltage requirements. Select based on needed packaging type (surface mount, 780-BGA).

Usage Considerations

Not RoHS compliant—may not be suitable for regions or applications with strict environmental requirements. Has a moisture sensitivity level of 3, so needs careful handling and storage. Pay attention to supply voltage range and make sure supporting power circuitry matches. Check size and footprint compatibility for PCB layout.

Potential Equivalent/Replacement Models

Direct drop-in or pin-compatible equivalents not guaranteed due to part complexity and package specifics. Alternative Cyclone IV E series parts with similar logic and I/O, such as EP4CE40F23C7 or EP4CE40F23I7, may serve, but package size and some features might differ. For fully compatible replacements or extensive cross-references, customers should contact Ariat-Tech sales team for guidance based on application needs and inventory.

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