Manufacturer Part Number

EP4CE115F23C8LN

Description

Cyclone IV E series field programmable gate array (FPGA) produced by Intel. Features 280 input/output pins in a 484-ball fine-pitch ball grid array (FBGA) package. Suitable for advanced digital system designs that require high logic density, large memory capacity, and multiple I/O options. Offers high-integration for high-performance and flexible design applications.

Specifications

Series: Cyclone IV E

Number of Logic Elements/Cells: 114,480

LABs/CLBs: 7,155

Total RAM Bits: 3,981,312

I/O Pins: 280

Voltage Supply: 0.97V to 1.03V

Operating Temperature: 0°C to 85°C (TJ)

Package: 484-BGA (23x23 mm)

Mounting: Surface mount technology

RoHS Compliant; MSL Level 3 (168 hours); REACH Unaffected

ECCN: 3A001A7A

HTSUS: 8542.39.0001

Inventory: 6,554 pieces, new and original in stock

Device Structure

The FPGA uses a 484-ball fine-pitch BGA package, optimized for high-density, surface mount applications. Contains 7,155 Logic Array Blocks (LABs) that consist of various logic elements, all interconnected in a scalable design. Dedicated blocks for embedded memory, clock management, and I/O support. Built with non-volatile configuration memory that loads user-defined hardware functions on power-up.

Performance Characteristics

High-performance with 114,480 logic elements allowing complex functions and large-scale processing. RAM blocks providing nearly 4Mb memory to support buffering, temporary data storage, and state machines. Supports high I/O with 280 pins for maximum connectivity. Efficient and reliable operation within a voltage range of 0.97V to 1.03V. Designed for low power consumption and high-speed operation.

Application Environments

Ideal for industrial, embedded, communications, medical, network, video/image processing, automotive, and control system applications. Suitable for users needing hardware accelerators, data path customization, interface bridging, and protocol translation. Works reliably within typical commercial temperature ranges and surface-mount environments.

Selection Guidelines

Choose this model if you need high logic cell count, substantial on-chip memory, and a large number of I/O pins. The 484-BGA package fits applications where dense board layouts limit space. Rated for standard temperature, so only use in environments from 0°C to 85°C. Surface mount assembly recommended. If you need RoHS compliant and moisture-restricted parts, this model fits.

Usage Considerations

Handle according to MSL Level 3 precautions; must be soldered and dry-packed within 168 hours after opening. Proper PCB design and reflow profiles are important due to FBGA packaging. Ensure voltage regulators in your design consistently deliver between 0.97V and 1.03V. Confirm that the number of I/O and memory available meet your functional requirements. Avoid use in environments outside recommended temperature range.

Potential Equivalent/Replacement Models

Several other Cyclone IV E series FPGAs may provide similar performance with slight differences in resources, pin count, or package size, such as:

EP4CE115F29C8N

EP4CE115F23I8N

EP4CE115F23I7N

EP4CE115F23C8N

EP4CE115F29C8LN

Other Cyclone IV or Cyclone V series FPGAs may be considered based on logic and RAM requirements, temperature needs, and package type. If none of the above meet your requirements, or you need a drop-in replacement, please contact Ariat-Tech sales team for detailed guidance and availability.

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