| EP3SL200F1152I3 | |
|---|---|
| Part Number | EP3SL200F1152I3 |
| Manufacturer | Intel |
| Description | IC FPGA 744 I/O 1152FBGA |
| Quantity Available | 14095 pcs new original in stock. Request Stock & Quotation |
| Datasheets | 1.EP3SL200F1152I3.pdf2.EP3SL200F1152I3.pdf3.EP3SL200F1152I3.pdf4.EP3SL200F1152I3.pdf5.EP3SL200F1152I3.pdf6.EP3SL200F1152I3.pdf7.EP3SL200F1152I3.pdf8.EP3SL200F1152I3.pdf |
| Download | EP3SL200F1152I3 Details PDF |
| EP3SL200F1152I3 Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of EP3SL200F1152I3 | |||
|---|---|---|---|
| Manufacturer Part Number | EP3SL200F1152I3 | Category | Integrated Circuits (ICs) |
| Manufacturer | Intel | Description | IC FPGA 744 I/O 1152FBGA |
| Package / Case | 1152-FBGA (35x35) | Quantity Available | 14095 pcs |
| Voltage - Supply | 0.86V ~ 1.15V | Total RAM Bits | 10901504 |
| Supplier Device Package | 1152-FBGA (35x35) | Series | Stratix® III L |
| Package / Case | 1152-BBGA, FCBGA | Package | Tray |
| Operating Temperature | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells | 200000 |
| Number of LABs/CLBs | 8000 | Number of I/O | 744 |
| Mounting Type | Surface Mount | Base Product Number | EP3SL200 |
| Download | EP3SL200F1152I3 PDF - DE.pdf | ||
Product Model
EP3SL200F1152I3
Introduction
Intel Stratix III L Series Embedded FPGA
Brand and Manufacturer
Intel
Features
High-density FPGA
Integrated memory blocks
DSP blocks for signal processing
Multi-track interconnect for high-speed communication
Product Performance
Supports up to 200,000 Logic Elements/Cells
Advanced power management
High-performance signal processing capabilities
Technical Specifications
8000 LABs/CLBs
10901504 Total RAM Bits
744 I/O Pins
Dimensions, Shape, and Packaging
1152-BBGA, FCBGA
Surface Mount Package
Footprint: 35x35 mm
Quality and Reliability
Designed for demanding applications
Extensive validation and testing
Product Advantages
Scalable architecture
High capacity and performance for complex designs
Product Competitiveness
Leading-edge technology for embedded applications
Competitive within high-performance FPGA markets
Compatibility
Compatible with a wide array of voltage supplies and I/O standards
Standard Certification and Compliance
Complies with industry standard regulations and certifications (specific certifications not stated)
Lifespan and Sustainability
Robust design for extended product lifespan in various environments
Obsolete product status suggests limited sustainability
Actual Application Fields
Telecommunications
Networking Infrastructure
High-speed computing systems
Industrial applications
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| EP3SL200F1152I3 Image | EP3SL200F1152I3 Picture | EP3SL200F1152I3 PDF | |||
| EP3SL200F1152I3 Datasheet | Download EP3SL200F1152I3 Datasheet | Manufacturer Intel | |||
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