Manufacturer Part Number

EP3C25U256C7N

Description

Cyclone III Field Programmable Gate Array. 156 general-purpose I/O pins. 256-ball ultra-thin BGA package. Used for custom logic, fast processing, signal management. Enables designers to reprogram logic for evolving needs.

Specifications

Logic Elements: 24,624 logic cells for flexible design.

LABs/CLBs: 1,539 Logic Array Blocks for data and control processing.

Total RAM: 608,256 bits for temporary data storage and buffering.

I/O Pins: 156 available for digital connections.

Supply Voltage: Operates on 1.15V to 1.25V for power-saving designs.

Operating Temperature: 0°C to 85°C, suitable for standard environments.

Package: 256-LFBGA, measures 14x14 mm, ensures compact board layout.

Mounting: Surface mount technology for streamlined assembly.

RoHS Compliant: Meets environmental standards; safe for global applications.

Moisture Sensitivity Level: Level 3, up to 168 hours exposure.

REACH Status: Unaffected, no hazardous chemicals.

ECCN Code: 3A991D, export control information.

HTSUS: 8542.39.0001, customs classification.

Device Structure

Programmable logic array design featuring numerous logic blocks and embedded memory. Built on Cyclone III architecture, optimized for power and performance. 256-ball BGA package improves thermal management and electrical connections.

Performance Characteristics

Real-time, high-speed logic processing. Low power consumption, good for battery-powered or energy-sensitive systems. Reliable operation in moderate temperatures (0°C–85°C). Large I/O count and memory capacity allow complex and flexible computation for various applications.

Application Environments

Industrial control systems. Video/image processing equipment. Communication infrastructure. Consumer electronics and embedded devices. Rapid prototyping and R&D projects.

Selection Guidelines

Choose this model for mid-range to large logic demands, moderate memory requirements, and limited space. Ideal for applications needing many I/O pins and flexible logic. Suits designers seeking low power, standard temperature, and compact layout.

Usage Considerations

Respect the supply voltage range (1.15V–1.25V) for optimal operation. Surface mount package requires effective reflow soldering and moisture management; adhere to MSL3 mandate. Design for proper thermal dissipation on dense boards. Confirm I/O and memory needs match project requirements.

Potential Equivalent/Replacement Models

For similar function and pin-count, consider other Cyclone III devices (e.g., EP3C25F256C7N, EP3C25E144C7N) with package/BGA variations. Other FPGA device families (like Cyclone IV) may be suitable if more advanced features or power performance are required. If no direct equivalents found, contact Ariat-Tech sales team for tailored recommendations and up-to-date alternatives.

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