EP1C3T144C7
Part Number EP1C3T144C7
Manufacturer Intel
Description IC FPGA 104 I/O 144TQFP
Quantity Available 11203 pcs new original in stock.
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Datasheets 1.EP1C3T144C7.pdf2.EP1C3T144C7.pdf3.EP1C3T144C7.pdf4.EP1C3T144C7.pdf5.EP1C3T144C7.pdf6.EP1C3T144C7.pdf7.EP1C3T144C7.pdf8.EP1C3T144C7.pdf
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Technical Information of EP1C3T144C7
Manufacturer Part Number EP1C3T144C7 Category Integrated Circuits (ICs)
Manufacturer Intel Description IC FPGA 104 I/O 144TQFP
Package / Case 144-TQFP (20x20) Quantity Available 11203 pcs
Voltage - Supply 1.425V ~ 1.575V Total RAM Bits 59904
Supplier Device Package 144-TQFP (20x20) Series Cyclone®
Package / Case 144-LQFP Package Tray
Operating Temperature 0°C ~ 85°C (TJ) Number of Logic Elements/Cells 2910
Number of LABs/CLBs 291 Number of I/O 104
Mounting Type Surface Mount Base Product Number EP1C3
DownloadEP1C3T144C7 PDF - DE.pdf

Product Model

EP1C3T144C7

Introduction

Intel Cyclone® series FPGA, targeted for a wide range of applications.

Brand and Manufacturer

Intel

Features

Compact FPGA with 291 logic blocks and 2910 logic elements

On-chip memory of 59,904 total RAM bits

Versatility with 104 user I/Os

Low-power consumption due to optimized supply voltage

Product Performance

High-performance logic capabilities

Efficient power management supporting 1.425V to 1.575V operation

Technical Specifications

Number of LABs/CLBs: 291

Number of Logic Elements/Cells: 2910

Total RAM Bits: 59904

Number of I/O: 104

Voltage - Supply: 1.425V ~ 1.575V

Dimensions, Shape, and Packaging

Surface Mount 144-LQFP

20x20 mm TQFP packaging

Quality and Reliability

Built to Intel's high-quality and reliability standards

Product Advantages

Optimal balance between cost and performance

Small form factor suitable for space-constrained applications

Product Competitiveness

Part of the popular and competitively-priced Cyclone® series

Compatibility

Designed for broad compatibility with multiple systems and platforms

Standard Certification and Compliance

Manufactured under standard industry certifications and compliances

Lifespan and Sustainability

Long-term performance with appropriate heat management

Actual Application Fields

Widely used in telecommunication, automotive, consumer electronics, and industrial applications

Note: The product status is obsolete, which may affect the availability and support for ongoing applications.

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