Manufacturer Part Number

XC17S50APDG8C

Description

This device is a 500kb PROM (Programmable Read-Only Memory) chip, single-time programmable (OTP), designed for serial programming applications. It is suitable for moderate temperature environments and packaged in an 8-pin dual in-line package (DIP). The chip is ROHS3 compliant, in through-hole style, and is now classified as obsolete.

Specifications

Memory type: PROM (OTP, single write)

Memory size: 500kb

Supply voltage range: 3.0V to 3.6V

Operating temperature: 0°C to +70°C (Commercial Temp)

Package: 8-DIP, 0.300" (7.62mm) wide

Device supplier package: 8-PDIP

Mounting type: Through Hole

RoHS: Compliant (ROHS3)

Moisture Sensitivity Level: 1 (Unlimited storage conditions)

REACH: Unaffected

ECCN: EAR99 (No export restrictions)

HTSUS code: 8542.32.0071

Device Structure

The device is a monolithic integrated circuit, consisting of a memory array organized to support serial access and programming. Internal logic includes command handling for serial data input. The chip is encased in a plastic DIP package with 8 leads for easy mounting on a PCB (through-hole assembly).

Performance Characteristics

Single-programming (write-once) keeps data secure against accidental overwrite

Serial interface enables easy design integration with lower pin count and straightforward firmware design

Designed for low voltage operation (3V-3.6V), supporting modern electronic devices

Suitable for environments not exceeding 70°C

Reliable data retention after programming

Application Environments

Used for FPGA configuration storage, embedded systems, and logic device configuration

Common in industrial control boards, legacy embedded systems, and development environments where a simple, one-time-programmable solution is needed

Suitable in applications requiring moderate-temperature use and non-volatile, permanent memory storage

Not compatible for automotive or extreme temperature/high-reliability environments

Selection Guidelines

Choose for one-time programming needs and when you require moderate storage (500kb)

Fits in circuits where a through-hole, DIP memory is preferred for prototyping or ease of PCB manual assembly

Best for projects not requiring further modification of stored data

Ensure voltage and temperature requirements of your system match the device specifications

Always verify pinout and package compatibility with layout

Usage Considerations

Once programmed, data on the device cannot be changed

Ensure correct data/programming before burning into the device

Handle per standard antistatic practices to avoid device damage

The device is obsolete, so consider lifecycle and sourcing future availability

Confirm compatibility with target FPGA or system logic before designing

Potential Equivalent/Replacement Models

There are limited direct replacements due to obsolescence and specific package/OTP needs. Alternative models may include:

Xilinx XC17S50A series (other package types or similar memory size)

Xilinx/AMD XC17S50AV series

Atmel AT17LV series (compare in terms of package/pinout, supply voltage, and programming interface)

Lattice ispVM series or Microchip equivalent PROMs (require pin and function review)

If no direct replacement with the same electrical and physical characteristics is found, please contact the Ariat-Tech sales team for guidance and to discuss available options suitable for your application or possible redesign recommendations.

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