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Home Products Connectors, Interconnects Rectangular Connectors - Headers, Male Pins HTSW-120-05-T-S-LL
HTSW-120-05-T-S-LL
Part Number HTSW-120-05-T-S-LL
Manufacturer Samtec Inc.
Description CONN HEADER VERT 20POS 2.54MM
Quantity Available Request Stock & Quotation
Datasheets
HTSW-120-05-T-S-LL Price Request Price & Lead Time Online
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Technical Information of HTSW-120-05-T-S-LL
Manufacturer Part Number HTSW-120-05-T-S-LL Category Connectors, Interconnects
Manufacturer Samtec, Inc. Description CONN HEADER VERT 20POS 2.54MM
Package / Case Bulk Quantity Available Available Stock
Voltage Rating - Termination Kinked Pin, Solder
Style Board to Board or Cable Shrouding Unshrouded
Series HTSW Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm) Package Bulk
Overall Contact Length 0.335" (8.51mm) Operating Temperature -55°C ~ 105°C
Number of Rows 1 Number of Positions Loaded All
Number of Positions 20 Mounting Type Through Hole
Material Flammability Rating UL94 V-0 Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP) Insulation Height 0.100" (2.54mm)
Insulation Color Natural Ingress Protection -
Features - Fastening Type Push-Pull
Current Rating (Amps) Varies by Wire Gauge Contact Type Male Pin
Contact Shape Square Contact Material Phosphor Bronze
Contact Length - Post 0.130" (3.30mm) Contact Length - Mating 0.105" (2.67mm)
Contact Finish Thickness - Post - Contact Finish Thickness - Mating -
Contact Finish - Post Tin Contact Finish - Mating Tin
Connector Type Header Base Product Number HTSW-120
Applications -  
HTSW-120-05-T-S-LL are New and Original in Stock, Find HTSW-120-05-T-S-LL electronics components stock, Datasheet, Inventory and Price at Ariat-Tech.com Online, Order HTSW-120-05-T-S-LL Samtec Inc. with warrantied and confidence from Ariat Technology Limitd. Ship via DHL/FedEx/UPS. Payment with Wire Transfer or PayPal is OK.
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Frequently Asked Questions

  • How does the 0.100" (2.54mm) pitch of the HTSW-120-05-T-S-LL influence mating compatibility with standard board-to-board connectors? The uniform 2.54mm spacing ensures compatibility with a wide range of industry-standard headers and receptacles, facilitating straightforward integration into existing designs without custom tooling for the HTSW-120-05-T-S-LL.
  • What design implications arise from the kinked pin solder termination on the HTSW-120-05-T-S-LL when planning PCB hole diameters? The kinked pins typically require holes sized to accommodate the 0.130" (3.30mm) post length, providing strain relief that helps withstand thermal cycling and mechanical stress during assembly and operation of the HTSW-120-05-T-S-LL.
  • How does the Phosphor Bronze contact material combined with Tin finish in the HTSW-120-05-T-S-LL influence resistance to oxidation and contact reliability over time? This material pair delivers low insertion force and stable conductivity, particularly beneficial in signal paths where repeated mating is common, though it may benefit from additional conformal coating in high-humidity conditions for the HTSW-120-05-T-S-LL.
  • In what operating conditions is the -55°C to 105°C temperature range of the HTSW-120-05-T-S-LL particularly advantageous for system reliability? This range supports use in environments with thermal extremes, such as industrial controls or transportation equipment, where maintaining connection integrity prevents intermittent failures in the HTSW-120-05-T-S-LL.
  • How should engineers account for the current rating varying by wire gauge when using the HTSW-120-05-T-S-LL in power distribution circuits? Selecting a thicker wire gauge allows higher current without exceeding contact heating limits, ensuring the connector handles the amperage specified for that gauge without compromising solder joint longevity in the HTSW-120-05-T-S-LL.
  • What considerations should be made regarding the insulation height of 0.100" (2.54mm) in the HTSW-120-05-T-S-LL for proper clearance in crowded PCB layouts? The 0.100" height provides adequate standoff distance to minimize risk of shorting between adjacent pins or to the board surface, critical in high-density assemblies using the HTSW-120-05-T-S-LL.
  • Why might the square contact shape in the HTSW-120-05-T-S-LL be preferred in applications with potential misalignment during mating? Square contacts reduce the likelihood of rotational misalignment compared to round ones, leading to more predictable mating forces and consistent electrical contact in vibration-prone setups with the HTSW-120-05-T-S-LL.
  • How does the 20-position arrangement of the HTSW-120-05-T-S-LL affect the overall board footprint when compared to a 10-position header? Doubling the positions roughly doubles the connector length to approximately 49.1mm, offering more interconnect points per unit length but requiring careful allocation of board real estate to avoid excessive spacing in the HTSW-120-05-T-S-LL.
  • In comparison to multi-row connectors, what layout benefits does the single-row HTSW-120-05-T-S-LL provide for simplified wiring in compact devices? The single row configuration minimizes crossing wires and simplifies trace routing, which is advantageous in space-constrained consumer or portable electronics designs employing the HTSW-120-05-T-S-LL.
  • What limitations should be noted when considering the HTSW-120-05-T-S-LL for high-voltage applications beyond its intended low-power signal use? With voltage rating not explicitly defined, it is optimized for low-voltage operations; attempting higher voltages could lead to insulation breakdown given the LCP material properties of the HTSW-120-05-T-S-LL.
  • How does the UL94 V-0 rating of the HTSW-120-05-T-S-LL influence its use in enclosed or safety-critical electronic equipment? The flame retardant property helps ensure compliance with enclosure fire safety standards, reducing the hazard of fire propagation from the connector itself in the HTSW-120-05-T-S-LL.
  • Should the HTSW-120-05-T-S-LL be evaluated against higher-density 1.27mm pitch alternatives for applications needing more I/O in the same space? The coarser 2.54mm pitch of the HTSW-120-05-T-S-LL trades density for larger contact areas and easier alignment, potentially increasing manufacturing yield in dense but not ultra-compact boards utilizing the HTSW-120-05-T-S-LL.
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