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Home Products Connectors, Interconnects Rectangular Connectors - Headers, Receptacles, Female Sockets ESQT-122-03-LM-D-368
ESQT-122-03-LM-D-368
Part Number ESQT-122-03-LM-D-368
Manufacturer Samtec Inc.
Description CONN SOCKET 44POS 0.079 GOLD PCB
Quantity Available 3310 pcs new original in stock.
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Datasheets
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Technical Information of ESQT-122-03-LM-D-368
Manufacturer Part Number ESQT-122-03-LM-D-368 Category Connectors, Interconnects
Manufacturer Samtec, Inc. Description CONN SOCKET 44POS 0.079 GOLD PCB
Package / Case Tube Quantity Available 3310 pcs
Voltage Rating - Termination Solder
Style Board to Board or Cable Series ESQT
Row Spacing - Mating 0.079" (2.00mm) Pitch - Mating 0.079" (2.00mm)
Package Tube Operating Temperature -55°C ~ 125°C
Number of Rows 2 Number of Positions Loaded All
Number of Positions 44 Mounting Type Through Hole
Material Flammability Rating UL94 V-0 Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP) Insulation Height 0.368" (9.35mm)
Insulation Color Black Ingress Protection -
Features - Fastening Type Push-Pull
Current Rating (Amps) 4.5A per Contact Contact Type Forked
Contact Shape Square Contact Material Phosphor Bronze
Contact Length - Post 0.090" (2.29mm) Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm) Contact Finish - Post Tin
Contact Finish - Mating Gold Connector Type Elevated Socket
Base Product Number ESQT-122 Applications -
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Frequently Asked Questions

  • How does the 0.368" (9.35mm) insulation height of the ESQT-122-03-LM-D-368 influence standoff clearance and airflow in board-to-board layouts? The elevated profile creates a defined gap that improves convective cooling around the phosphor bronze contacts and reduces the risk of shorting adjacent components on the PCB, though it requires exact alignment fixtures during insertion to maintain the 0.079" row spacing without binding.
  • What thermal and derating steps should be applied when operating the ESQT-122-03-LM-D-368 at its 4.5A per contact limit across all 44 positions? The aggregate current load generates predictable heat that the UL94 V-0 LCP housing must dissipate, so power traces on the mating header should incorporate wider copper pours and the total system power budget must stay below the connector's collective rating to avoid contact softening or increased resistance over time.
  • How does the -55°C to 125°C operating range of the ESQT-122-03-LM-D-368 interact with the square contact geometry under vibration and thermal shock? Phosphor bronze retains its spring force across this temperature window, allowing the forked contacts to maintain consistent wipe and retention even when expansion coefficients cause minor pitch shifts, making the ESQT-122-03-LM-D-368 suitable for environments with rapid thermal cycling.
  • Why select the phosphor bronze base material with square contacts for the ESQT-122-03-LM-D-368 instead of rounder or alternative alloys? The square cross-section increases pull-out resistance against mating forces while the phosphor bronze alloy provides reliable elasticity without the higher cost or oxidation sensitivity sometimes seen in other base metals, supporting consistent low-resistance performance across repeated engagements.
  • What long-term contact resistance behavior is expected from the 10.0µin gold finish on the ESQT-122-03-LM-D-368 mating surfaces? The thin gold layer prevents oxidation at the interface and minimizes wear during normal mating, keeping resistance stable even after hundreds of cycles, but it benefits from a controlled gold wipe during assembly to remove any embedded particles that could otherwise raise contact impedance.
  • How does the 2.00mm pitch and 2-row layout of the ESQT-122-03-LM-D-368 constrain trace routing and via placement on the host PCB? The 0.079" row spacing and through-hole termination pattern limit the number of signal layers that can be routed without excessive via stitching, requiring careful ground plane division to maintain impedance control between adjacent rows.
  • What manufacturing adjustments are needed when populating the ESQT-122-03-LM-D-368 using through-hole solder reflow? The 0.090" (2.29mm) post length demands precise stencil printing and reflow profile control to achieve uniform fillets without bridging the elevated posts, while the black LCP insulation must remain clear of molten solder to preserve dielectric properties.
  • Compared to flush non-elevated sockets, how does the profile of the ESQT-122-03-LM-D-368 change insertion forces and post-mating inspection access? The 0.368" elevation lowers peak mating force and opens a visual window for contact inspection after seating, reducing the chance of undetected misalignment that could occur in flush designs where the contacts are hidden behind the board edge.
  • When choosing among elevated socket families, why might the ESQT-122-03-LM-D-368 be preferred for applications demanding UL94 V-0 compliance? The LCP insulation combined with the UL94 V-0 rating provides inherent flame resistance that simplifies compliance testing, while the specific 0.368" height and 4.5A rating allow tighter integration in safety-critical board-to-board stacks than higher-profile or lower-current alternatives.
  • What PCB thickness and via sizing rules apply when terminating the ESQT-122-03-LM-D-368 due to its 0.090" post length? The post length sets a minimum board thickness to ensure adequate solder fillet formation and mechanical standoff, typically requiring vias sized 0.020" larger than the post diameter to accommodate the 2.29mm insertion depth without excessive stand-up or tombstoning.
  • How does the tin finish on the posts of the ESQT-122-03-LM-D-368 influence solder joint reliability during high-volume assembly? The tin plating promotes excellent wetting and flux activity during wave or vapor-phase soldering, but it requires a controlled shelf-life period after stencil printing to minimize oxidation that could otherwise lead to incomplete fillets or higher joint resistance.
  • For which mating cycle counts does the gold-forked contact set in the ESQT-122-03-LM-D-368 remain within acceptable resistance drift? With the 10µin gold layer and square phosphor bronze contacts, the ESQT-122-03-LM-D-368 typically stays within specification through several hundred cycles, after which contact wear begins to increase resistance unless mating gold wipe techniques are applied to restore the interface.
  • Does the 4.5A per contact rating of the ESQT-122-03-LM-D-368 allow limited power delivery alongside signals in the same connector? The rating supports modest DC power on separate rows without violating thermal limits, provided the board layout isolates power planes and the total current per header is derated to account for shared thermal resistance through the LCP body.
  • Compared to connectors using beryllium copper contacts, what key trade-offs does the phosphor bronze in the ESQT-122-03-LM-D-368 introduce for high-reliability board-to-board use? Phosphor bronze offers superior corrosion resistance and lower raw material cost, yet its lower conductivity can raise contact resistance in high-frequency applications, potentially requiring additional shielding or wider signal traces when the ESQT-122-03-LM-D-368 is substituted for BeCu-based parts.
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