On April 19, 2026 (local time), media reports citing sources familiar with the matter revealed that Google, a subsidiary of Alphabet, is in talks with...

According to *The Business Times*, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot production line began delivering equipment to its R&D team in Febr...

On April 6 local time, U.S. artificial intelligence (AI) technology giant Anthropic announced that it has signed a new agreement with Google and Broad...

On April 1, Microsoft announced it would invest $5.5 billion in Singapore to continue expanding its cloud and artificial intelligence (AI) infrastruct...

Samsung Electronics will be the first to exclusively supply its next-generation HBM4 to OpenAI, the world’s largest artificial intelligence (AI) comp...

G3VM-VY MOSFET Relays Omron's general-purpose MOSFET relays in SOP 4-pin packages for use in a wide ...

G9TA and G9TB Latching Power Relays Omron’s relays were designed for high current switching applica...

D2F Ultra-Mini Unsealed Switch Omron's subminiature basic switch is offered in many terminal variati...

B3SE Ultra-Thin Sealed Surface-Mounting Tactile Switches Omron's B3SE PCB surface-mounting 6 mm ...