According to reports from Fast Technology, Samsung's DS division recently completed the logic chip design for its HBM4 memory. The Foundry division ha...

Bourns, a globally recognized leader in electronic components manufacturing, has expanded its product portfolio with the launch of the AEC-Q200-compli...

Apple's A-series smartphone processors have evolved from the A7 (28nm) to the A18 Pro (3nm), featuring more cores, transistors, and functionalities. A...

Global tech giants like NVIDIA and TSMC are advancing their technologies to maintain leadership in the artificial intelligence (AI) industry. Meanwhil...

Market reports suggest that Apple is likely to be among the first customers for TSMC’s 2nm process technology. However, due to cost considerations, t...

G3VM-VY MOSFET Relays Omron's general-purpose MOSFET relays in SOP 4-pin packages for use in a wide ...

G9TA and G9TB Latching Power Relays Omron’s relays were designed for high current switching applica...

D2F Ultra-Mini Unsealed Switch Omron's subminiature basic switch is offered in many terminal variati...

B3SE Ultra-Thin Sealed Surface-Mounting Tactile Switches Omron's B3SE PCB surface-mounting 6 mm ...