Technical Information of MPC8347CVVAGDB
Manufacturer Part Number MPC8347CVVAGDB Category Integrated Circuits (ICs)
Manufacturer NXP USA Inc. Description IC MPU MPC83XX 400MHZ 672TBGA
Package / Case 672-LBGA (35x35) Quantity Available 241 pcs
Voltage - I/O 2.5V, 3.3V USB USB 2.0 + PHY (2)
Supplier Device Package 672-LBGA (35x35) Speed 400MHz
Series MPC83xx Security Features -
SATA - RAM Controllers DDR
Product Status Obsolete Package / Case 672-LBGA
Package Tray Operating Temperature -40°C ~ 105°C (TA)
Number of Cores/Bus Width 1 Core, 32-Bit Mounting Type Surface Mount
Graphics Acceleration No Ethernet 10/100/1000Mbps (2)
Display & Interface Controllers - Core Processor PowerPC e300
Co-Processors/DSP - Base Product Number MPC8347
Additional Interfaces DUART, I²C, PCI, SPI  
DownloadMPC8347CVVAGDB PDF - DE.pdf

Product Model

MPC8347CVVAGDB

Introduction

NXP Semiconductors PowerPC e300 Core Microprocessor

Brand and Manufacturer

NXP Semiconductors

Features

PowerPC e300 Core

32-Bit Bus Architecture

Integrated 10/100/1000Mbps Ethernet Controllers

Dual USB 2.0 with PHY

DDR RAM Controllers

Support for DUART, I2C, PCI, SPI Interfaces

Product Performance

400MHz Clock Speed

High-Performance PowerPC e300 Core

Robust Data Processing Capabilities

Technical Specifications

1 Core Processor

400MHz Operating Frequency

DDR RAM Controller Support

672-LBGA Package

Surface Mount Mounting Type

Dimensions, Shape, and Packaging

Package Size: 35mm x 35mm

672-LBGA Case

Quality and Reliability

Suitable for Operating Temperatures from -40°C to 105°C

Constructed for Surface Mount Technology

Product Advantages

Integrated Dual Ethernet for Networking

Dual USB 2.0 Support for Peripheral Connectivity

Product Competitiveness

Power Efficient 32-Bit PowerPC Core

Embedded Microprocessor for Industrial Applications

Compatibility

Supports Various Communication Interfaces (DUART, I2C, PCI, SPI)

Standard Certification and Compliance

Complies with Industry Standards for Microprocessors (Specific certifications not provided)

Lifespan and Sustainability

Durable Construction for Extended Use in a Range of Temperatures

Actual Application Fields

Used in Embedded Computing, Networking and Communication Systems, Industrial Control

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