| EDF8165A3MC-GD-F-R | |
|---|---|
| Part Number | EDF8165A3MC-GD-F-R |
| Manufacturer | Micron Technology Inc. |
| Description | IC DRAM 8G FBGA |
| Quantity Available | 12944 pcs new original in stock. Request Stock & Quotation |
| Datasheets | 1.EDF8165A3MC-GD-F-R.pdf2.EDF8165A3MC-GD-F-R.pdf |
| Download | EDF8165A3MC-GD-F-R Details PDF |
| EDF8165A3MC-GD-F-R Price |
Request Price & Lead Time Online or Email us: Info@ariat-tech.com |
| Technical Information of EDF8165A3MC-GD-F-R | |||
|---|---|---|---|
| Manufacturer Part Number | EDF8165A3MC-GD-F-R | Category | Integrated Circuits (ICs) |
| Manufacturer | Micron Technology | Description | IC DRAM 8G FBGA |
| Package / Case | Tape & Reel (TR) | Quantity Available | 12944 pcs |
| Write Cycle Time - Word, Page | - | Voltage - Supply | - |
| Technology | - | Supplier Device Package | - |
| Series | - | Package / Case | - |
| Package | Tape & Reel (TR) | Operating Temperature | - |
| Mounting Type | - | Memory Type | - |
| Memory Size | - | Memory Interface | - |
| Memory Format | - | Base Product Number | EDF8165 |
| Download | EDF8165A3MC-GD-F-R PDF - DE.pdf | ||
Manufacturer Part Number
EDF8165A3MC-GD-F-R
Description
This is an 8 Gigabit DRAM memory IC from Micron Technology. Designed for general memory storage applications, it comes in a compact FBGA package. New and original parts are available, with 979 pieces in stock.
Specifications
Base part number is EDF8165. RoHS3 compliant. Moisture Sensitivity Level (MSL) is 3, which means it must be soldered within 168 hours of being exposed to ambient conditions. The status of REACH compliance is unaffected, indicating no restricted hazardous substances are present.
Device Structure
The device is a memory IC using DRAM technology in FBGA packaging. This allows for efficient mounting on circuit boards and is optimized for high density memory integration in modern electronics.
Performance Characteristics
High-speed data storage. Reliable operation due to original manufacturing. Rated for general use in standard conditions. The detailed voltage supply, operating temperature, and speed information should be checked in the datasheet or confirmed with the supplier.
Application Environments
Commonly used in computers, network equipment, industrial electronics, and consumer devices. Suitable for environments where high memory density and reliability are needed.
Selection Guidelines
Choose this model if you need 8Gb DRAM memory, compact form factor, and RoHS-compliant options. Make sure your device supports FBGA mounting and is compatible with the component dimensions and electrical requirements.
Usage Considerations
Handle carefully to avoid moisture-related defects (follow MSL 3 guidelines). Make sure to use it within the specified soldering time. Store in recommended conditions. Ensure all electrical parameters match your system requirements and verify the memory interface compatibility.
Potential Equivalent/Replacement Models
Currently, detailed equivalent or alternative models are not listed. For alternatives, similar Micron DRAM parts or compatible models from Samsung, SK Hynix, or other major memory manufacturers may be considered with appropriate specifications. To find exact replacements and verify compatibility, please contact our Ariat-Tech sales team or refer to the online cross-reference tool for memory ICs.
Email us: Info@Ariat-Tech.com or RFQ EDF8165A3MC-GD-F-R Online.
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| EDF8165A3MC-GD-F-R Image | EDF8165A3MC-GD-F-R Picture | EDF8165A3MC-GD-F-R PDF |
| EDF8165A3MC-GD-F-R Datasheet | Download EDF8165A3MC-GD-F-R Datasheet | Manufacturer Micron Technology |
