Manufacturer Part Number

AFS600-2FGG484I

Description

This is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, designed for flexible hardware logic customization. Supports 172 input/output interfaces in a compact 484-ball grid array package. Offers 600,000 system gates and 110,592 RAM bits, making it suitable for complex embedded systems and configurable digital circuits. Works well in harsh environments due to wide operating temperature range.

Specifications

600,000 system gates

172 I/O ports

Total RAM bits: 110,592

Operating voltage: 1.425V to 1.575V

Package: 484-FPBGA, 23mm x 23mm

Mounting type: Surface Mount

Temperature range: -40°C to +100°C (junction temperature)

Product status: Active, RoHS3 compliant, REACH unaffected

Moisture sensitivity level (MSL): 3 (168 hours)

ECCN: 3A991D

HTSUS: 8542.39.0001

Device Structure

FPGA architecture with field programmable logic elements

484-pin fine pitch BGA (FBGA) format for high-density mounting

Memory blocks for data storage

Multiple user-configurable I/O banks

On-chip resources for fast signal processing

Supports Fusion® series features for mixed-signal capabilities

Performance Characteristics

Offers high logic gate density for demanding applications

Fast signal switching and flexible user programmability

Wide voltage and temperature range makes it reliable in industrial settings

Low power consumption due to efficient voltage range

Stable operation across environments

Application Environments

Factory automation systems

Industrial control and sensor networks

Aerospace and defense hardware

Medical devices requiring custom logic

Communications infrastructure

Digital signal processing & embedded computing

Any application needing reliable, flexible, and high-performance logic customization

Selection Guidelines

Choose based on required logic density, number of I/O, available RAM, and operating environment

Ensure system voltage matches device requirements (1.425V ~ 1.575V)

Verify that operating temperature range fits application

Check compatibility with mounting type (surface mount, BGA)

RoHS3 compliance may be necessary for international distribution

Consider Moisture Sensitivity Level restrictions for manufacturing and storage

Use FPBGA package footprint (23x23mm) for PCB design

Usage Considerations

Follow proper handling for Moisture Sensitivity Level 3 devices (max exposure before reflow: 168 hours)

Ensure ESD and thermal management in PCB and system design

Confirm FPGA programming toolchain compatibility with the Fusion® series

Static sensitive, needs careful soldering and placement

Check for firmware and logic configuration support from Microchip

Verify stock availability; currently 773 units in original condition in tray packaging

Potential Equivalent/Replacement Models

Alternative models may be available within the Fusion® series or similar FPGAs from Microchip Technology, such as:

AFS600-2FGG484I (different speed grades or temperature ranges)

AFS600-2FGG484 (same logic density, non-industrial temp)

AFS250-2FGG484I (lower gate count, same temp range and package)

AFS900-2FGG484I (higher gate count, same package)

AFS600-3FGG484I (different speed grade)

For fully compatible or drop-in equivalents, please compare specific gate count, I/O, and package. For other manufacturer alternatives, cross-check with Lattice, Xilinx, or Intel/Altera offerings (with similar BGA package, voltage, and I/O specs).

If no suitable equivalent or replacement is available in your required category, please contact the Ariat-Tech sales team for more information and tailored selection support.

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