At CES 2025, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global leader in power systems and IoT semiconductors, joined forces with Flex (NAS...

Micron recently announced the construction of a new advanced packaging facility for high-bandwidth memory (HBM) near its existing operations in Singap...

According to reports from Fast Technology, Samsung's DS division recently completed the logic chip design for its HBM4 memory. The Foundry division ha...

Bourns, a globally recognized leader in electronic components manufacturing, has expanded its product portfolio with the launch of the AEC-Q200-compli...

Apple's A-series smartphone processors have evolved from the A7 (28nm) to the A18 Pro (3nm), featuring more cores, transistors, and functionalities. A...

PD30 Series Photoelectric Sensor Carlo Gavazzi’s miniature photoelectric sensors are high-performan...

XC112/XR112 Evaluation Kit for the A111 Pulsed Coherent RadarAcconeer's XC112 and XR112 evaluation kit with flat flexible cables and support for up to...

MINAS A6 Series Servo Drives and Motors Panasonic's MINAS A6 family assures stable operation by supp...

UV LED Driver Board RayVio’s UV LED driver board for XE and XP1 series of UV-C emitters RayVio&rs...

Industrial and Extended Test DDR SDRAM Insignis' DDR SDRAM devices guarantee operation at elevated j...