On April 19, 2026 (local time), media reports citing sources familiar with the matter revealed that Google, a subsidiary of Alphabet, is in talks with...

According to *The Business Times*, TSMC’s CoPoS (Chip-on-Panel-on-Substrate) pilot production line began delivering equipment to its R&D team in Febr...

On April 6 local time, U.S. artificial intelligence (AI) technology giant Anthropic announced that it has signed a new agreement with Google and Broad...

On April 1, Microsoft announced it would invest $5.5 billion in Singapore to continue expanding its cloud and artificial intelligence (AI) infrastruct...

Samsung Electronics will be the first to exclusively supply its next-generation HBM4 to OpenAI, the world’s largest artificial intelligence (AI) comp...

HSD Connector System Amphenol ICC's high-speed data (HSD) connector system is compliant with USCAR-2...

HD-EFI Connector Series Amphenol's micro-miniature interfaces are ideal for high-performance applica...

High Power Card Edge (HPCE®) Amphenol’s next-generation power card edge connector Amphenol's...

Minitek® Pwr 5.7 mm Connector System Amphenol ICC's Minitek Pwr connector system is suitable fo...

USB Type-C Waterproof Connectors Amphenol LTW’s Type-C connectors deliver high data transmission ra...