XCZU6CG-L1FFVC900I
Part Number XCZU6CG-L1FFVC900I
Manufacturer Xilinx
Description IC FPGA 204 I/O 900FCBGA
Quantity Available 2903 pcs new original in stock.
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Datasheets XCZU6CG-L1FFVC900I.pdf
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Technical Information of XCZU6CG-L1FFVC900I
Manufacturer Part Number XCZU6CG-L1FFVC900I Category Integrated Circuits (ICs)
Manufacturer Xilinx Description IC FPGA 204 I/O 900FCBGA
Package / Case Tray Quantity Available 2903 pcs
Supplier Device Package 900-FCBGA (31x31) Speed 500MHz, 1.2GHz
Series Zynq® UltraScale+™ MPSoC CG RAM Size 256KB
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Peripherals DMA, WDT
Packaging Tray Package / Case 900-BBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ) Number of I/O 204
Moisture Sensitivity Level (MSL) 4 (72 Hours) Manufacturer Standard Lead Time 10 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant Flash Size -
Detailed Description Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 469K+ Logic Cells 256KB 500MHz, 1.2GHz 900-FCBGA (31x31) Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Architecture MCU, FPGA
DownloadXCZU6CG-L1FFVC900I PDF - DE.pdf

Product Model


XCZU6CG-L1FFVC900I

Introduction


Xilinx Zynq UltraScale+ MPSoC CG Family SoC

Brand and Manufacturer


Xilinx

Features


Dual ARM Cortex-A53 MPCore with CoreSight

Dual ARM Cortex-R5 with CoreSight

Zynq UltraScale+ FPGA Integration

204 I/O Pins

Product Performance


High Compute Density

Efficient Power Management

Advanced Multi-Processing Capabilities

Technical Specifications


MCU, FPGA Architecture

256KB RAM Size

500MHz, 1.2GHz Speed

469K+ Logic Cells

Dimensions, Shape, and Packaging


900-BBGA, FCBGA Package

31x31 mm FCBGA Supplier Device Package

Packaged in Tray

Quality and Reliability


Robust Operating Temperature Range (-40°C ~ 100°C)

Industry-Proven Xilinx Build Quality

Product Advantages


Seamless Integration of Processing and Programmable Logic

High System Performance for Embedded Applications

Product Competitiveness


Optimized for High-Performance Embedded Systems

Competitive Solution for Versatile System Design

Compatibility


Extensive Connectivity Options Including CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG

Standard Certification and Compliance


Compliant with Industry Standards

Manufactured under Rigorous Quality Controls

Lifespan and Sustainability


Durable and Long-Lasting Design

Sustainable Through Prolonged Operational Life

Actual Application Fields


Industrial Automation

Embedded Vision and Robotics

Automotive Systems

Data Centers and Networking

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