XCZU3EG-2SFVA625I
Part Number XCZU3EG-2SFVA625I
Manufacturer Xilinx
Description IC FPGA 180 I/O 625FCBGA
Quantity Available 2980 pcs new original in stock.
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Datasheets XCZU3EG-2SFVA625I.pdf
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Technical Information of XCZU3EG-2SFVA625I
Manufacturer Part Number XCZU3EG-2SFVA625I Category Integrated Circuits (ICs)
Manufacturer Xilinx Description IC FPGA 180 I/O 625FCBGA
Package / Case Tray Quantity Available 2980 pcs
Supplier Device Package 625-FCBGA (21x21) Speed 533MHz, 600MHz, 1.3GHz
Series Zynq® UltraScale+™ MPSoC EG RAM Size 256KB
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Peripherals DMA, WDT
Packaging Tray Package / Case 625-BFBGA, FCBGA
Operating Temperature -40°C ~ 100°C (TJ) Number of I/O 180
Moisture Sensitivity Level (MSL) 4 (72 Hours) Manufacturer Standard Lead Time 10 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant Flash Size -
Detailed Description Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 256KB 533MHz, 600MHz, 1.3GHz 625-FCBGA (21x21) Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Architecture MCU, FPGA
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