Manufacturer Part Number

5CGXFC5C7U19C8N

Description

Cyclone V GX FPGA. 224 input/output pins, 484-ball ultra-fine pitch BGA package (UBGA). Delivers 77000 logic elements/cells, 5001216 total RAM bits. Supports 1.07V to 1.13V supply. Surface mount, tray packaging. Temperature range 0°C to 85°C. Ideal for embedded system designs needing high performance and flexibility. RoHS compliant and REACH unaffected for environmental safety. Active product with reliable inventory.

Specifications

Logic Cells: 77000

LABs/CLBs: 29080

RAM Bits: 5001216

I/O Pins: 224

Supply Voltage: 1.07V to 1.13V

Mounting: Surface Mount

Package: 484-FBGA / 484-UBGA (19x19mm)

Temperature Range: 0°C to 85°C

Moisture Sensitivity: Level 3 (168 hours)

RoHS: Compliant

REACH: Unaffected

Device Structure

Based on Intel’s Cyclone V GX architecture. Field Programmable Gate Array (FPGA) with 77000 logic elements organized in configurable logic blocks (CLBs). 29080 LABs for logic implementation. Built-in SRAM memory totaling 5001216 bits. 224 programmable I/O pins for flexible connection. Housed in 484-ball UBGA package (19x19mm), suitable for fine-pitch surface mounting.

Performance Characteristics

Delivers moderate-to-high logic density with fast signal processing. Wide voltage range (1.07V–1.13V) for stable operation and less power consumption. Supports high-speed logic designs, multiple communication interfaces, and real-time processing. Reliable up to 85°C junction temperature for robust industrial and embedded applications.

Application Environments

Best for embedded systems, communication infrastructures, industrial automation, medical equipment, and data processing units needing adaptable logic functions. Utilized where high pin count, flexible I/O, power efficiency, and moderate thermal tolerance are required.

Selection Guidelines

Choose this model when you need up to 77000 logic elements and 224 I/O in a compact surface mount package. Check voltage (supply should be 1.07V–1.13V). Ensure your PCB design supports 484-UBGA layout and MSL 3 handling during assembly and reflow. Verify that the operational environment is within 0°C to 85°C.

Usage Considerations

Maintain storage and handling under MSL 3 (168 hours at factory conditions before assembly). Follow correct tray storage to avoid moisture absorption. Ensure precise reflow soldering for fine-pitch UBGA package. Verify power supply stability for 1.07–1.13V range. Comply with PCB layout for thermal dissipation, and validate logic designs before deployment.

Potential Equivalent/Replacement Models

Direct drop-in or fully compatible alternatives are limited due to the specific logic elements and I/O count. Close matches in the Cyclone V GX family (e.g., 5CGXFC5C6U19C8N, 5CGXFC5C7U15C8N) may provide similar features with slightly different configurations. For exact compatibility, check Intel’s Cyclone V GX product tables or FPGA selector guides for pin-compatible models with equivalent I/O and memory. If you need alternatives outside the Cyclone V GX series, consider contacting the Ariat-Tech sales team for cross-reference support and availability of compatible models.

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