Manufacturer Part Number

5CGXFC5C7M13C8N

Description

Cyclone V GX series Field Programmable Gate Array (FPGA) with 175 general-purpose I/Os. Features 77,000 logic elements/cells and 5,001,216 total RAM bits. Packaged in 383-ball Thin Fine Pitch Ball Grid Array (TFBGA), 13x13mm. High integration for mid-range FPGA needs, suitable for flexible embedded designs.

Specifications

Series: Cyclone V GX

Logic Elements/Cells: 77,000

Total RAM Bits: 5,001,216

I/O Count: 175

LABs/CLBs: 29,080

Voltage Supply: 1.07V to 1.13V

Mounting: Surface Mount

Operating Temperature: 0°C to 85°C (Junction)

Package: 383-TFBGA (13x13mm)

RoHS Status: Compliant

Moisture Sensitivity: Level 3 (MSL 3, 168 hours)

REACH: Unaffected

ECCN: 3A001A2C

HTS code: 8542.39.0001

Device Structure

Silicon-based monolithic integrated circuit.

BGA package with 383 solder balls, grid array size 13mm by 13mm.

Includes multiple logic array blocks (LABs), embedded RAM, and general-purpose digital I/Os.

Performance Characteristics

Flexible, reprogrammable digital logic.

Mid-range logic density for various processing workloads.

Supports high-speed serial interfaces and additional memory blocks.

Power-efficient with a narrow supply voltage (1.07 to 1.13V).

Suitable for reliable operation from 0°C to 85°C junction temperature.

Application Environments

Designed for embedded systems, industrial automation, communications, video processing, and hardware acceleration.

Adaptable for consumer, telecom, medical, automotive, and industrial equipment requiring programmable logic and hardware-level customization.

Selection Guidelines

Choose for projects needing moderate logic density, up to 77,000 logic elements.

Ensure system power supply can maintain 1.07V to 1.13V range.

Check available board space for 13x13mm BGA mounting.

Confirm application does not require more than 175 I/O pins.

Verify thermal design supports up to 85°C junction temperature.

Fits designs requiring RoHS compliant and environmentally safe components.

Usage Considerations

Use proper ESD protection and handle with care to avoid moisture absorption due to MSL 3 sensitivity.

Ensure thermal management for continuous operation at high junction temperatures.

Follow Intel's guidelines for PCB footprint and reflow soldering specific to 383-TFBGA.

Allow for in-system programmability and update considerations during design.

Check compatibility with your development tools; verify device programming is supported.

Potential Equivalent/Replacement Models

There are no direct equivalent or alternative models confirmed for 5CGXFC5C7M13C8N. For cross-reference options or suitable substitutes, please contact the Ariat-Tech sales team for more information and technical support.

5CGXFC5C7M13C8N are New and Original in Stock, Find 5CGXFC5C7M13C8N electronics components stock, Datasheet, Inventory and Price at Ariat-Tech.com Online, Order 5CGXFC5C7M13C8N Intel with warrantied and confidence from Ariat Technology Limitd. Ship via DHL/FedEx/UPS. Payment with Wire Transfer or PayPal is OK.
Email us: Info@Ariat-Tech.com or RFQ 5CGXFC5C7M13C8N Online.