Technical Information of 5CGXFC5C6U19I7N
Manufacturer Part Number 5CGXFC5C6U19I7N Category Integrated Circuits (ICs)
Manufacturer Intel Description IC FPGA 224 I/O 484UBGA
Package / Case 484-UBGA (19x19) Quantity Available 2200 pcs
Voltage - Supply 1.07V ~ 1.13V Total RAM Bits 5001216
Supplier Device Package 484-UBGA (19x19) Series Cyclone® V GX
Product Status Active Package / Case 484-FBGA
Package Tray Operating Temperature -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells 77000 Number of LABs/CLBs 29080
Number of I/O 224 Mounting Type Surface Mount
Base Product Number 5CGXFC5  
Download5CGXFC5C6U19I7N PDF - DE.pdf

Product Model

5CGXFC5C6U19I7N

Introduction

High-capacity, low-power FPGA designed for embedded applications

Brand and Manufacturer

Intel

Features

29080 LABs/CLBs for logical function implementation

77000 Logic Elements/Cells

5001216 Total RAM Bits for high data storage

224 I/O pins for versatile connectivity

Surface Mount Technology

Product Performance

Operates effectively between 1.07V and 1.13V

Sustainable performance from -40°C to 100°C operating temperature

Technical Specifications

Voltage supply range: 1.07V ~ 1.13V

Operating temperature range: -40°C ~ 100°C (TJ)

Surface Mount Mounting Type

Dimensions, Shape, and Packaging

484-FBGA package

Package dimensions: 484-UBGA (19x19)

Packaged in trays for safe transportation

Quality and Reliability

Designed for high reliability and stable operation under extreme conditions

Product Advantages

Optimized for energy efficiency and thermal management

Compact form factor for embedded systems

Product Competitiveness

Combines high logic density with extensive I/O capabilities

Competitive in both power consumption and processing capability

Compatibility

Compatible with various design tools and software used for FPGA programming

Supports multiple I/O standards for easy integration into existing designs

Standard Certification and Compliance

Complies with relevant international standards for electronic components

Lifespan and Sustainability

Designed for long-term deployment with durable materials and construction

Actual Application Fields

Widely used in communications, automotive systems, and industrial applications

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