Manufacturer Part Number

XCKU115-2FLVD1924E

Description

High-performance, field programmable gate array (FPGA) designed for complex embedded and logic-intensive applications. Offers 832 input/output pins, 1451100 logic cells, and 77.7 Mbits total RAM, making it ideal for demanding computation and data routing tasks. Uses a 1924-ball flip chip ball grid array (FCBGA) package for surface mounting. Supports high-speed operation and large-scale designs.

Specifications

Kintex UltraScale series

1924-ball FCBGA package (45mm x 45mm)

832 I/O pins

1451100 logic elements/cells

77,721,600 bits of RAM

Supply voltage: 0.922V ~ 0.979V

Operating temperature: 0°C to 100°C (TJ)

Moisture Sensitivity Level: MSL 4 (safe for 72 hours out of package)

RoHS3 compliant

ECCN: 3A001A7B

HTSUS: 8542.39.0001

Device Structure

Based on AMD's Kintex UltraScale architecture with 82,920 LABs/CLBs (logic array blocks/configurable logic blocks), featuring advanced programmable logic, high-density routing resources, large integrated memory capacity, and extensive I/O capabilities in a high pin-count FCBGA package for robust surface mount connections.

Performance Characteristics

Able to process complex algorithms and handle extensive parallel processing workloads. Provides high throughput and low latency for embedded systems, signal processing, and networking. Stable performance in a wide temperature range and supports fast clock speeds due to optimized supply voltage.

Application Environments

Best used in communications infrastructure systems, data center accelerators, aerospace and defense applications, research instrumentation, digital signal processing (DSP), high-speed networking equipment, and industrial control systems requiring customizable logic and large bandwidth.

Selection Guidelines

Select this model if your application demands a large number of logic cells, high I/O count, and high RAM bits. Ideal for projects that need advanced programmability, flexibility in design, and robust data handling. Evaluate your system requirements for I/O connectivity, operating temperature, and form factor compatibility with the 1924-FCBGA surface mount. Ensure proper handling for MSL4-rated parts.

Usage Considerations

Handle with care due to MSL 4 classification, ensuring reflow soldering within 72 hours after opening. Confirm power supply within specified voltage range to prevent device instability. Make sure cooling and thermal management is adequate for extended operation at higher temperatures. Double-check board design for correct pad layout to support the large FCBGA package.

Potential Equivalent/Replacement Models

There are equivalent and alternative models in the Kintex UltraScale series such as:

XCKU115-1FLVD1924E

XCKU115-3FLVD1924E

XCKU095-2FLVA1517E (for lower logic and I/O requirements)

Similar-performance FPGAs from AMD/Xilinx Virtex UltraScale and UltraScale+ series might be considered based on system needs.

If the listed part alternatives do not meet your requirements, or if you are searching for drop-in direct replacements, please contact Ariat-Tech sales team for more details, availability, or guidance on cross-references.

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