Targeting the Advanced Packaging Market: ASML Reportedly to Develop Hybrid Bonding Equipment

According to industry rumors, following the recent launch of two lithography systems designed for the advanced packaging market, lithography giant ASML is making a major push into the semiconductor back-end manufacturing equipment market, with a primary focus on the rapidly growing advanced packaging sector. According to a report by South Korean media outlet The Elec, ASML will collaborate with external component suppliers to develop a complete set of hybrid bonding equipment required for advanced packaging.

The report notes that ASML’s potential component partners include Prodrive Technologies and VDL-ETG, both of which are long-standing suppliers of ASML’s lithography systems. The former supplies linear motors and servo drives for the maglev systems in ASML’s extreme ultraviolet (EUV) lithography machines, while the latter manufactures the associated mechanical structures. The maglev system enables high-precision movement of wafer stages and offers lower vibration characteristics compared to traditional air-bearing systems. Since the hybrid bonding process demands ultra-high precision alignment, such technologies are gradually being integrated into hybrid bonding equipment.

Hybrid bonding is a next-generation packaging technology used for chip stacking and interconnection. Unlike thermal compression bonding (TC bonding), hybrid bonding does not require the use of tiny metal bumps; instead, it directly bonds the copper surfaces between chips. In this process, the bonding head picks up the die, moves it onto the substrate or wafer, and applies pressure to form a direct bond between the copper layers.

Industry analysts note that ASML’s entry into the hybrid bonding sector was actually anticipated. In 2024, ASML launched its first device for semiconductor back-end manufacturing, the TWINSCAN XT:260, a deep ultraviolet (DUV) lithography system for advanced packaging primarily used to form redistribution layers (RDLs) on interposers; ASML also released an integrated lithography solution combining DUV and EUV lithography, improving wafer bonding alignment accuracy to approximately 5 nm.

ASML Chief Technology Officer Marco Peters noted that the company is closely evaluating opportunities in the semiconductor packaging sector and exploring how to build a product portfolio in this field. It is reported that after reviewing the technology roadmaps of memory wafer manufacturers such as SK Hynix, ASML confirmed that there is a clear demand for stacked process equipment.

Furthermore, the rapid growth of the advanced packaging market and the strong performance of related equipment suppliers have become key factors driving ASML’s entry into the hybrid bonding sector.

Besi Semiconductor reported that its backlog at the end of the fourth quarter surged 105% year-over-year, primarily driven by demand for hybrid bonding; ASMPT also estimated last year that advanced packaging would account for approximately one-quarter of its total revenue.

Applied Materials has long been active in the advanced packaging sector. Last year, the company partnered with Besi Semiconductor to develop the Kynex die-to-wafer (D2W) hybrid bonding system, which integrates Besi’s Datacon 8800 Cameo Ultra Plus AC hybrid bonding equipment.

Another source familiar with the matter noted that ASML possesses one of the world’s most advanced ultra-high-precision control technologies, and its hybrid bonding technology could significantly reshape the current market landscape.

However, ASML stated that it is not currently pursuing the hybrid bonding business.