As cars become more intelligent and autopilots become more and more intensive, the demand for manufacturing processes for in-vehicle device chips is increasing. Samsung and TSMC have separately created a new version of the 8nm and 7nm processes. Samsung 8nm has two versions of 8LPP and 8LPU, both of which are evolution versions of its 10mm process, while the automotive-grade 8nm should be another deep upgrade, but more details are not disclosed.
Samsung has emphasized some high requirements for automotive chips, such as the AEC-Q100 reliability standard, which can withstand the temperature range of -40 ° C to 105 ° C. The supply chain management system must also comply with IATF 169169 certification, in addition to the manufacturing tools and equipment itself. Different ISO 26262 (ASIL) safety specifications must be met.
Samsung's current technology for car chips is 28nm (28FDS), 14nm, so upgrading to 8nm will be a huge leap.
TSMC's latest technology for the automotive environment is 16nm (16FFC), and will be upgraded based on the first generation 7nm (N7), which is expected to be commercially available by 2020.
In fact, Synopsys has developed automotive-grade IP for TSMC 7nm, and it is easy to continue upgrading in the future.
Oh, there are also GlobalFoundries. The process used for automobiles is 22FDX and 12LP. It is still not backward at present, but since Gexin has given up the development of research and development, how to face competition in the future will be a headache.