SK Hynix Licensed for DBI Ultra 2.5D / 3D Interconnect Technology, Impacting 16-Layer Stack Memory

According to the fast technology report, SK Hynix announced that it has signed a new patent and technology license agreement with Invensas, a subsidiary of Xperi Corp, and obtained the latter's DBI Ultra 2.5D / 3D interconnection technology license.


It is understood that DBI Ultra is a patented die-wafer hybrid bonding interconnect technology. It uses chemical bonding to connect different interconnect layers, eliminating the need for copper pillars and underfill, and does not increase height. Greatly reduce the overall stack height, free up space, and double the 8-layer stack to the 16-layer stack for greater capacity. Each square millimeter of area can accommodate 100,000 to 1 million interconnect openings, compared to each square millimeter The traditional copper pillar interconnect technology with up to 625 interconnect openings can greatly increase the transmission bandwidth.

The production of DBI Ultra requires a new process, but the yield is higher and high temperature is not required. High temperature is the key factor affecting the yield.

Similar to other next-generation interconnect technologies, DBI Ultra also flexibly supports 2.5D and 3D integrated packaging, and can integrate IP modules of different sizes and different processes, so it can not only be used to manufacture memory chips such as DRAM, 3DS, HBM, etc. For highly integrated CPU, GPU, ASIC, FPGA, SoC.

At present, SK Hynix has not disclosed where the DBI Ultra packaging technology will be used, but DRAM and HBM are obviously the best choices.

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