Henkel/Loctite
Henkel/Loctite

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.

Image

Part Number

Description

ECAD
Model

Quote

ARRAY LED IMS SEOUL SEMI ZPWR

ARRAY STAR LED IMS SEOUL SEMI P5

LOCTITE GC 10 SAC305T3 885 52U

POWER SUPPLY FOR TOUCH SCRN MOD

ARRAY LED IMS LUXEON K2

63/37 370, 3% .024DIA 22AWG

MP200 RWF SOLDER FLUX NO CLEAN

TOUCH SCREEN 4-WIRE 10.4" ANTIGL

THERMSTRATE 1000 TC 1.75 X 1.25

TOUCH SCREEN 4-WIRE 15.0" ANTIGL

60/40 370 3% .032DIA 20AWG

63/37 HYDRO-X 2% .024DIA 22AWG

63/37 CRYSL 502 3% .015DIA 27AWG

LOCTITE GC 3W SAC305T3 895V 52U

63/37 400 1% .020DIA 22AWG

SOLDER MASK MSC 1000S 250 ML

BRD STAR LED IMS LUXEON REBEL

BOARD LED IMS OSRAM OSTAR SMD

BOARD LED IMS GOLDEN DRAGON

97SC HYDRO-X 2% .064DIA 14AWG

SAC305 BAR SOLDR 2.5LB +/- 0.2LB

63/37 400 3% .032DIA 20AWG

3508 CORNERBOND 30 ML

BOARD LED IMS CREE X-LAMP

ARRAY LED IMS LITE-ON LOPL

BRD STAR LED IMS AVAGO MOONSTONE

ALL IN ONE KIT 7 TOUCHSCREEN

TOUCH SCREEN 4-WIRE 6.4" ANTIGLR

BOARD LED IMS LUXEON K2

HMP 366 3% .028DIA 21AWG

63/37 BAR SLDR 2LB +/- 0.2LB BAR

60/40 370 3% .024DIA 22AWG

ARRAY LED IMS AVAGO MNSTONE

STRIP LED IMS NICHIA PWR LED

63/37 400 2% .048DIA 16AWG

CABLE RS232 FOR TOUCH SCREEN MOD

63/37 MP200 SOLDER FLUX 25GM

TOUCH SCREEN 4-WIRE 7.0" ANTIGLR

SILICONE GREASE TG100

HMP 366 3% .022DIA. 23AWG

TOUCH SCRN 5-WIRE 8.4" ANTI-GLR

BOARD LED IMS LUMEX SML-LX

97SC C511 2% .022DIA 22AWG 24SWG

SOLDER PASTE HF 212 - 600GRAM JA

BRD STAR LED IMS LITE-ON LOPL

97SC C511 2% .032DIA 20AWG

60/40 370 3% .015DIA 27AWG

TOUCH SCREEN 4-WIRE 8.5" ANTIGLR

CABLE USB FOR TOUCH SCREEN MOD

SI 5140 METHOXY 85 GR TB/BN

Email: Info@ariat-tech.comHK TEL: +00 852-30501966ADD: Rm 2703 27F Ho King Comm Center 2-16,
Fa Yuen St MongKok Kowloon, Hong Kong.